Invention Application
- Patent Title: LIGHT-EMITTING DEVICE PACKAGE
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Application No.: US15401604Application Date: 2017-01-09
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Publication No.: US20170279009A1Publication Date: 2017-09-28
- Inventor: SUNG-MOK HONG , Kyung-wook HWANG
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2016-0036959 20160328
- Main IPC: H01L33/46
- IPC: H01L33/46 ; H01L33/64 ; H01L33/50 ; H01L33/62 ; H01L33/52

Abstract:
A light-emitting device package includes a supporting substrate, a light-emitting device on the supporting substrate, an adhesive layer on at least a portion of a side surface or lower surface of the light-emitting device, the adhesive layer connecting the light-emitting device to the supporting substrate, and an air layer in a space defined by the supporting substrate, the light-emitting device, and the adhesive layer.
Public/Granted literature
- US09991426B2 Light-emitting device package Public/Granted day:2018-06-05
Information query
IPC分类: