Invention Application
- Patent Title: CURABLE HEAT RADIATION COMPOSITION
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Application No.: US15627532Application Date: 2017-06-20
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Publication No.: US20170283645A1Publication Date: 2017-10-05
- Inventor: Yoichiro SAKAGUCHI , Kentarou TAKAHASHI , Keisuke MAMEDA
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Tokyo
- Priority: JP2012-079351 20120330; JP2012-114763 20120518
- Main IPC: C09D163/00
- IPC: C09D163/00 ; C08K3/28 ; H01L23/373 ; C08K3/38 ; C09D133/00 ; C09J5/06 ; C08K3/22 ; C08K3/40

Abstract:
The present invention relates to a curable heat radiation composition which includes two types of fillers with different compressive breaking strengths (except when the two types of fillers are the same substance) and a thermosetting resin, the compressive breaking strength ratio of the two types of fillers [compressive breaking strength of a filler (A) with a higher compressive breaking strength/compressive breaking strength of a filler (B) with a lower compressive breaking strength] being 5 to 1,500, the compressive breaking strength of the filler (A) being 100 to 1,500 MPa, and the compressive breaking strength of the filler (B) being 1.0 to 20 MPa, an adhesive sheet using the composition and a method for producing the same. An aluminum nitride is preferable as the filler (A) and hexagonal boron nitride agglomerated particles are preferable as the filler (B).
Public/Granted literature
- US10717896B2 Curable heat radiation composition Public/Granted day:2020-07-21
Information query
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