公开(公告)号：US20170283645A1

公开(公告)日：2017-10-05

申请号：US15627532

申请日：2017-06-20

Applicant: SHOWA DENKO K.K.

Inventor： Yoichiro SAKAGUCHI ,  Kentarou TAKAHASHI ,  Keisuke MAMEDA

IPC: C09D163/00 ,  C08K3/28 ,  H01L23/373 ,  C08K3/38 ,  C09D133/00 ,  C09J5/06 ,  C08K3/22 ,  C08K3/40

CPC classification number: C09D163/00 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C08K3/40 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2003/282 ,  C08K2003/385 ,  C09D133/00 ,  C09D133/14 ,  C09J5/06 ,  H01L23/24 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K7/20481 ,  Y10T156/10 ,  Y10T428/2848 ,  Y10T428/31511 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to a curable heat radiation composition which includes two types of fillers with different compressive breaking strengths (except when the two types of fillers are the same substance) and a thermosetting resin, the compressive breaking strength ratio of the two types of fillers [compressive breaking strength of a filler (A) with a higher compressive breaking strength/compressive breaking strength of a filler (B) with a lower compressive breaking strength] being 5 to 1,500, the compressive breaking strength of the filler (A) being 100 to 1,500 MPa, and the compressive breaking strength of the filler (B) being 1.0 to 20 MPa, an adhesive sheet using the composition and a method for producing the same. An aluminum nitride is preferable as the filler (A) and hexagonal boron nitride agglomerated particles are preferable as the filler (B).

公开(公告)号：US20180009926A1

公开(公告)日：2018-01-11

申请号：US15543284

申请日：2016-04-19

Applicant: SHOWA DENKO K.K.

Inventor： Kunihiro KUROKI ,  Kenji MIURA ,  Yoichiro SAKAGUCHI ,  Kohei SAITO

IPC: C08F299/04 ,  C09D5/00 ,  C08J5/24 ,  C08F299/02 ,  C04B41/48 ,  C09D153/00 ,  C08K7/14 ,  C04B111/72

CPC classification number: C08F299/0464 ,  C04B41/4857 ,  C04B2111/72 ,  C08F2/44 ,  C08F283/01 ,  C08F290/06 ,  C08F299/00 ,  C08F299/028 ,  C08F299/045 ,  C08F299/0471 ,  C08J5/04 ,  C08J5/24 ,  C08J2353/00 ,  C08K5/098 ,  C08K5/36 ,  C08K7/14 ,  C09D5/00 ,  C09D5/002 ,  C09D153/00 ,  C09D201/02 ,  C09J4/06 ,  C08L67/00 ,  C08F267/06

Abstract: A radical-polymerizable resin composition comprising one or more metal-containing compounds (A) selected from a metal soap (A1) and a β-diketone skeleton-containing metal complex (A2); one or more thiol compounds (B) selected from a secondary thiol compound (B1) and a tertiary thiol compound (B2); and a radical-polymerizable compound (C) can stably cure under a dry condition, in water and in seawater and further on a wet substrate. The radical-polymerizable resin composition is useful as a repairing material for inorganic structure, a radical-polymerizable coating composition, a concrete spall preventing curable material, a reinforcing fiber-containing composite material, etc.

公开(公告)号：US20230058675A1

公开(公告)日：2023-02-23

申请号：US17788455

申请日：2020-12-21

Applicant: SHOWA DENKO K.K.

Inventor： Yoichiro SAKAGUCHI ,  Kohei SAITO

IPC: C08F283/01 ,  C08K13/02

Abstract: The invention provides a radically polymerizable resin composition capable of suppressing shrinkage while maintaining strength by adding an appropriate amount of an expansive additive to the radically polymerizable resin composition causing curing shrinkage by a decrease in the free volume of a liquid component during curing. The radically polymerizable resin composition comprises a radically polymerizable compound (A), an expansive additive (B), a radical polymerization initiator (C), and an aggregate (D). The aggregate (D) contains cement. The aggregate (D) is 330 to 800 parts by mass with respect to 100 parts by mass of the radically polymerizable compound (A).

公开(公告)号：US20200181365A1

公开(公告)日：2020-06-11

申请号：US16341151

申请日：2017-09-04

Applicant: SHOWA DENKO K.K.

Inventor： Yoichiro SAKAGUCHI ,  Takuya MINAMI ,  Yoshishige OKUNO ,  Atsushi UMINO ,  Yoshitaka ISHIBASHI

IPC: C08K5/548 ,  C08F20/00

Abstract: A curing accelerator can exhibit good curing acceleration performance and is excellent in storage stability, while maintaining sufficient pot life in a curing reaction of radical-polymerizable resins, and a radical-polymerizable resin composition uses the curing accelerator. The curing accelerator for radical-polymerizable resins includes a metal-containing compound (A), a thiol compound (B) and an aprotic solvent (C) having a dielectric constant of 10 or less, wherein the metal-containing compound (A) is one or more compounds selected from a metal soap (A1) and a β-diketone skeleton-having metal complex (A2), the thiol compound (B) is one or more compounds selected from a mono-functional primary thiol compound (B1), a secondary thiol compound (B2) and a tertiary thiol compound (B3), and the content of the aprotic solvent (C) is 10 to 1,000 parts by mass relative to 100 parts by mass of the total of the metal-containing compound (A) and the thiol compound (B).