Invention Application
- Patent Title: WASHING SOLUTION FOR SURFACE OF ELECTROLESS TIN PLATING FILM, REPLENISHING SOLUTION FOR SAID WASHING SOLUTION, AND METHOD FOR FORMING TIN PLATING LAYER
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Application No.: US15537963Application Date: 2015-09-17
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Publication No.: US20170342566A1Publication Date: 2017-11-30
- Inventor: Yuko SHIBANUMA , Tatsuya GODA , Jojiro NIGORO , Tomoko ICHIHASHI , Keisuke JOKO , Takahiro YAMADA , Tsuyoshi AMATANI
- Applicant: MEC COMPANY LTD.
- Applicant Address: JP Hyogo
- Assignee: MEC COMPANY LTD.
- Current Assignee: MEC COMPANY LTD.
- Current Assignee Address: JP Hyogo
- Priority: JP2014-263252 20141225
- International Application: PCT/JP2015/076490 WO 20150917
- Main IPC: C23C18/16
- IPC: C23C18/16 ; H05K3/18 ; H05K3/26

Abstract:
The invention relates to a washing solution for a tin plating film after electroless tin plating and before water washing. The invention also relates to a method for forming a tin plating film, the method includes a step of washing step using the washing solution. The washing solution according to the present invention is an acidic aqueous solution containing an acid, a complexing agent, a stabilizer and a chloride ion. The washing solution has a chloride ion concentration of 2 wt % or more, and a tin concentration of 0.5 wt % or less. The washing solution according to the present invention has good washing property for a tin plating film surface, and allows a tin plating film to easily maintain its properties. In addition the washing solution causes little influence on a tin plating film surface even when continuously used and is excellent in temporal stability.
Information query
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