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1.
公开(公告)号:US20200157394A1
公开(公告)日:2020-05-21
申请号:US16611250
申请日:2018-03-02
Applicant: MEC COMPANY LTD.
Inventor: Itsuro TOMATSU , Kosuke KUMAZAKI , Yasutaka AMITANI , Yuko SHIBANUMA , Ikuyo KATAYAMA
IPC: C09J179/02 , B32B15/08 , B32B15/20 , B32B37/12 , C23C22/06 , C23C22/63 , C23C22/68 , C09J11/04 , C09J5/02 , H05K3/38
Abstract: The coating film-forming composition includes an aromatic compound having an amino group and an aromatic ring in one molecule, and thio compound (sulfur oxoacids having a pKa of −1.9 or less and salts thereof are excluded). pH of the coating film-forming composition is 4 to 10. The thio compound is preferably one that ionized to form anions in a solution, and thiosulfate and thiocyanate are especially preferable. By bringing the coating film-forming composition into contact with the surface of a metal member, a coating film is formed on the surface of the metal member, so that a surface-treated metal member can be obtained.
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公开(公告)号:US20170342566A1
公开(公告)日:2017-11-30
申请号:US15537963
申请日:2015-09-17
Applicant: MEC COMPANY LTD.
Inventor: Yuko SHIBANUMA , Tatsuya GODA , Jojiro NIGORO , Tomoko ICHIHASHI , Keisuke JOKO , Takahiro YAMADA , Tsuyoshi AMATANI
CPC classification number: C23C18/1689 , C23C18/1834 , C23C18/54 , H05K3/187 , H05K3/24 , H05K3/26 , H05K2203/072 , H05K2203/0789
Abstract: The invention relates to a washing solution for a tin plating film after electroless tin plating and before water washing. The invention also relates to a method for forming a tin plating film, the method includes a step of washing step using the washing solution. The washing solution according to the present invention is an acidic aqueous solution containing an acid, a complexing agent, a stabilizer and a chloride ion. The washing solution has a chloride ion concentration of 2 wt % or more, and a tin concentration of 0.5 wt % or less. The washing solution according to the present invention has good washing property for a tin plating film surface, and allows a tin plating film to easily maintain its properties. In addition the washing solution causes little influence on a tin plating film surface even when continuously used and is excellent in temporal stability.
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