Invention Application
- Patent Title: APPARATUS AND METHOD FOR TREATING SUBSTRATE
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Application No.: US15604267Application Date: 2017-05-24
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Publication No.: US20170345641A1Publication Date: 2017-11-30
- Inventor: YOUNG HUN LEE , EUI SANG LIM
- Applicant: SEMES CO., LTD.
- Priority: KR10-2016-0065859 20160527
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B08B3/10 ; B08B3/08 ; H01L21/67 ; B08B3/02
Abstract:
Disclosed is a method for liquid-treating a substrate. In a method for treating a substrate, the substrate may be treated by supplying a treatment liquid onto the rotating substrate by using a first nozzle and a second nozzle, the first nozzle supplies the treatment liquid to an area including a central area on the substrate, and the second nozzle supplies the treatment liquid to a peripheral area of the substrate.
Information query
IPC分类:
