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公开(公告)号：US20200027724A1
公开(公告)日：2020-01-23
申请号：US16516905
申请日：2019-07-19
Applicant: SEMES CO., LTD.
Inventor： JINWOO JUNG , YOUNG HUN LEE , YONG HEE LEE , EUI SANG LIM
Abstract: An apparatus for treating a substrate comprises a chamber having a processing space in which a process of treating the substrate is performed and a fluid supply unit that supplies a treating fluid into the chamber. The fluid supply unit comprises a supply line, at least one orifice provided in the supply line, and a first heater provided on the orifice or upstream of the orifice. The first heater heats the treating fluid passing through the orifice to a set temperature or more.
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公开(公告)号：US20170345687A1
公开(公告)日：2017-11-30
申请号：US15604141
申请日：2017-05-24
Applicant: SEMES CO., LTD.
Inventor： HEEHWAN KIM , YOUNG HUN LEE
CPC classification number: H01L21/67051 , H01L21/02101 , H01L21/67017 , H01L21/6719
Abstract: Provided is an apparatus and method for supplying a fluid. The substrate treating apparatus comprises a treating unit for treating a substrate and a fluid supply unit for supplying fluid to the treating unit, wherein the fluid supply unit comprises a supply tank in which the fluid is stored, a supply line connecting the supply tank and the treating unit to supply the fluid from the supply tank to the treating unit, a filter installed on the supply line, and an exhaust line branching from the supply line, wherein a branch point of the exhaust line in the supply line is located upstream of the filter.
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公开(公告)号：US20170345680A1
公开(公告)日：2017-11-30
申请号：US15607356
申请日：2017-05-26
Applicant: SEMES CO., LTD.
Inventor： YOUNG HUN LEE , JAE MYOUNG LEE
IPC: H01L21/67 , B08B3/08 , B08B3/04 , B08B3/14 , H01L21/687 , H01L21/677
CPC classification number: H01L21/6704 , B08B3/041 , B08B3/08 , B08B3/14 , H01L21/67051 , H01L21/6719 , H01L21/67253 , H01L21/67703 , H01L21/67742 , H01L21/67781 , H01L21/68707 , H01L21/68764
Abstract: Disclosed are an apparatus and a method for liquid-treating a substrate. An apparatus for treating a substrate includes a liquid treatment chamber that supplies a liquid onto the substrate to liquid-treat the substrate, a drying chamber that removes the remained liquid on the substrate, and a transfer unit that transfers the substrate between the liquid treatment chamber and the drying chamber, wherein the transfer unit includes a hand that supports the substrate, and a weight measuring unit that measures a weight of the remained liquid on the substrate. A weight of a remained liquid on a substrate may be measured by measuring a weight of the substrate while the substrate is transferred.
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公开(公告)号：US20170341113A1
公开(公告)日：2017-11-30
申请号：US15604023
申请日：2017-05-24
Applicant: SEMES CO., LTD.
Inventor： DAE MIN KIM , YOUNG HUN LEE
CPC classification number: B08B7/04 , B08B3/08 , B08B7/0021 , B08B7/0071 , H01L21/02057 , H01L21/0206 , H01L21/02068 , H01L21/02101 , H01L21/67103 , H01L21/67109 , H01L21/67126 , H01L21/6719
Abstract: Provided is a method for treating a substrate which removes particle within a concave portion on a substrate having a thin film on which a pattern having the concave portion on its upper surface is formed. The substrate treating method according the present invention comprises a penetration step for penetrating a treatment liquid containing supercritical organic chemical solution into the concave portion; and a heating step for heating the substrate after the penetration step.
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公开(公告)号：US20210005470A1
公开(公告)日：2021-01-07
申请号：US17026389
申请日：2020-09-21
Applicant: SEMES CO., LTD.
Inventor： YONG HEE LEE , YOUNG HUN LEE , JINWOO JUNG , EUI SANG LIM
IPC: H01L21/67 , H01L21/02 , H01L21/687
Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.
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Patent Agency Ranking
公开(公告)号：US20190164787A1
公开(公告)日：2019-05-30
申请号：US16197458
申请日：2018-11-21
Applicant: SEMES CO., LTD.
Inventor： YONG HEE LEE , YOUNG HUN LEE , JINWOO JUNG , EUI SANG LIM
IPC: H01L21/67 , H01L21/02 , H01L21/687
Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.
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公开(公告)号：US20190035648A1
公开(公告)日：2019-01-31
申请号：US16044601
申请日：2018-07-25
Applicant: SEMES CO., LTD.
Inventor： YONG HEE LEE , YOUNG HUN LEE
CPC classification number: H01L21/67034 , H01L21/02052 , H01L21/02057 , H01L21/02101 , H01L21/6719 , H01L21/68742 , H01L21/68764
Abstract: Disclosed are an apparatus and a method for drying a substrate. The apparatus for drying a substrate, the apparatus includes a chamber having a treatment space in the interior thereof, a substrate support unit configured to the substrate in the treatment space, a conversion unit configured to convert a state of the substrate supported by the substrate support unit between a horizontal state and an inclined state, a fluid supply unit configured to supply a drying fluid into the treatment space, and a controller configured to control the conversion unit and the fluid supply unit. Because a part of the liquid that stays on the substrate may be made to flow down by converting the state of the substrate into an inclined state and the remaining liquid that stays on the substrate is removed by using the drying fluid later, a time for drying the substrate may be shortened.
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公开(公告)号：US20230018637A1
公开(公告)日：2023-01-19
申请号：US17955206
申请日：2022-09-28
Applicant: SEMES CO., LTD.
Inventor： YONG HEE LEE , YOUNG HUN LEE , JINWOO JUNG , EUI SANG LIM
IPC: H01L21/67 , H01L21/02 , H01L21/687
Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.
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公开(公告)号：US20200335364A1
公开(公告)日：2020-10-22
申请号：US16916246
申请日：2020-06-30
Applicant: SEMES CO., LTD.
Inventor： YOUNG HUN LEE , EUI SANG LIM
Abstract: Disclosed is a method for liquid-treating a substrate. In a method for treating a substrate, the substrate may be treated by supplying a treatment liquid onto the rotating substrate by using a first nozzle and a second nozzle, the first nozzle supplies the treatment liquid to an area including a central area on the substrate, and the second nozzle supplies the treatment liquid to a peripheral area of the substrate.
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公开(公告)号：US20170345688A1
公开(公告)日：2017-11-30
申请号：US15607361
申请日：2017-05-26
Applicant: SEMES CO., LTD.
Inventor： HYO WON LEE , YOUNG HUN LEE
CPC classification number: H01L21/67051 , B05C5/004 , B05C5/02 , B05C11/1005 , H01L21/67023 , H01L21/67034 , H01L21/67109 , H01L21/67178 , H01L21/6719 , H01L21/67253 , H01L21/67703
Abstract: Disclosed are an apparatus and a method for liquid-treating a substrate. An apparatus for treating a substrate includes a liquid treating unit that liquid-treats a substrate by supplying a liquid onto a substrate, a weight measuring unit that measures a weight of the remained liquid on the substrate, and a transfer unit that transfers the substrate between the liquid treating unit and the weight measuring unit. Accordingly, the weight of the remained liquid may be measured more promptly.
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