A retimer device is presented with a retimer with an array of connectors on a surface of the device that are configured to form a ball grid array to electrically connect the chip package to a circuit board. At least a portion of the connectors in the array are arranged on the surface in a hexagonal pattern. The connectors are assigned to the plurality of high speed connectors to arrange each high speed differential pair in the plurality of high speed differential pairs substantially orthogonally with respect to one or more other differential pairs in the plurality of high speed differential pairs.