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公开(公告)号：US10602607B2
公开(公告)日：2020-03-24
申请号：US15979268
申请日：2018-05-14
Applicant: Intel Corporation
Inventor： Timothy D. Wig , Steven K. Krooswyk , Marc Wells
Abstract: An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.
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公开(公告)号：US10517168B2
公开(公告)日：2019-12-24
申请号：US15979268
申请日：2018-05-14
Applicant: Intel Corporation
Inventor： Timothy D. Wig , Steven K. Krooswyk , Marc Wells
Abstract: An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.
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公开(公告)号：US20160380393A1
公开(公告)日：2016-12-29
申请号：US15079890
申请日：2016-03-24
Applicant: Intel Corporation
Inventor： Timothy D. Wig , Steven K. Krooswyk , Marc Wells
IPC: H01R13/66 , H01R13/6466 , H05K1/02 , H01R12/73
CPC classification number: H05K1/0251 , H01L23/66 , H05K1/0218 , H05K1/0219 , H05K1/0231 , H05K1/0233 , H05K1/0234 , H05K1/0245 , H05K1/117 , H05K2201/10015 , H05K2201/10022
Abstract: An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.
Abstract translation: 一种装置，包括：第一对导体，用于承载差分信号;至少一个与第一对导体相邻的接地导体，要连接到接地平面的接地导体，以及至少一个特定的导体，用于承载边带信号。 特定导体经由谐振抑制电路连接到接地层，并且谐振抑制电路包括电阻器。
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Patent Agency Ranking
公开(公告)号：US20200275549A1
公开(公告)日：2020-08-27
申请号：US16723784
申请日：2019-12-20
Applicant: Intel Corporation
Inventor： Timothy D. Wig , Steven K. Krooswyk , Marc Wells
Abstract: An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.
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公开(公告)号：US20170351640A1
公开(公告)日：2017-12-07
申请号：US15612209
申请日：2017-06-02
Applicant: Intel Corporation
Inventor： Manisha Nilange , Steven K. Krooswyk , Ernesto Rosales Galvan , Antonio Orozco Ramirez , Daniel S. Froelich , Mohiuddin M. Mazumder
CPC classification number: G06F15/7814 , G06F13/4068 , G06F13/4291 , G06F2213/0026
Abstract: A retimer device is presented with a retimer with an array of connectors on a surface of the device that are configured to form a ball grid array to electrically connect the chip package to a circuit board. At least a portion of the connectors in the array are arranged on the surface in a hexagonal pattern. The connectors are assigned to the plurality of high speed connectors to arrange each high speed differential pair in the plurality of high speed differential pairs substantially orthogonally with respect to one or more other differential pairs in the plurality of high speed differential pairs.
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公开(公告)号：US10999924B2
公开(公告)日：2021-05-04
申请号：US16723784
申请日：2019-12-20
Applicant: Intel Corporation
Inventor： Timothy D. Wig , Steven K. Krooswyk , Marc Wells
Abstract: An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.
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公开(公告)号：US20190021165A1
公开(公告)日：2019-01-17
申请号：US15979268
申请日：2018-05-14
Applicant: Intel Corporation
Inventor： Timothy D. Wig , Steven K. Krooswyk , Marc Wells
Abstract: An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.
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公开(公告)号：US09974161B2
公开(公告)日：2018-05-15
申请号：US15079890
申请日：2016-03-24
Applicant: Intel Corporation
Inventor： Timothy D. Wig , Steven K. Krooswyk , Marc Wells
CPC classification number: H05K1/0251 , H01L23/66 , H05K1/0218 , H05K1/0219 , H05K1/0231 , H05K1/0233 , H05K1/0234 , H05K1/0245 , H05K1/117 , H05K2201/10015 , H05K2201/10022
Abstract: An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.
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