Invention Application
- Patent Title: Packaged IC With Solderable Sidewalls
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Application No.: US15690074Application Date: 2017-08-29
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Publication No.: US20170365575A1Publication Date: 2017-12-21
- Inventor: Yong Lin , Vikas Gupta , Rongwei Zhang
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56 ; H01L23/544 ; H01L23/31 ; H01L21/304 ; H01L23/495 ; H01L21/48 ; H01L21/78
Abstract:
A packaged IC wherein a portion of the sidewalls of the packaged IC are solderable metal. A method of forming a packaged IC wherein a portion of the sidewalls of the wire bond pads or the flip chip pads that are exposed by sawing during singulation are solderable metal. A method of forming a packaged IC wherein all of the sidewalls of the wire bond pads or the flip chip pads that are exposed by sawing during singulation are solderable metal and a portion of sidewall of the molding compound is solderable metal.
Information query
IPC分类:
