公开(公告)号：US20230017286A1

公开(公告)日：2023-01-19

申请号：US17373958

申请日：2021-07-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rongwei Zhang ,  Chien Hao Wang ,  Bob Lee

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L21/78

Abstract: A semiconductor device includes a substrate and a semiconductor die including an active surface with bond pads, an opposite inactive surface, and stepped side surfaces extending between the active surface and the inactive surface. The stepped side surfaces include a first planar surface extending from the inactive surface towards the active surface, a second planar surface extending from the active surface towards the inactive surface, and a side surface offset between the first planar surface and the second planar surface. The semiconductor device further includes an adhesive layer covering at least a portion of a surface area of the second surface and attaching the semiconductor die to the substrate.

公开(公告)号：US10366944B2

公开(公告)日：2019-07-30

申请号：US15973828

申请日：2018-05-08

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rongwei Zhang ,  Vikas Gupta

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/48

Abstract: Described examples include a device including a semiconductor die having a first surface with bond pads and an opposite second surface attached to a substrate by an adhesive layer covering at least a portion of the surface area of the second surface. The adhesive layer includes first zones composed of a first polymeric compound and adding up to a first portion of the surface area, and second zones composed of a second polymeric compound and adding up to a second portion of the surface area, the first zones and the second zones being contiguous. The first polymeric compound has a first modulus and the second polymeric compound has a second modulus greater than the first modulus.

公开(公告)号：US09378984B2

公开(公告)日：2016-06-28

申请号：US14520406

申请日：2014-10-22

Applicant: Texas Instruments Incorporated

Inventor： Rongwei Zhang ,  Abram Castro

IPC: H01L21/00 ,  H01L21/56 ,  H01L23/29 ,  B29C45/14 ,  B29C45/00 ,  H01L23/00

CPC classification number: H01L24/48 ,  B29C45/0001 ,  B29C45/0046 ,  B29C45/14655 ,  B29C45/14836 ,  C08K3/10 ,  C08K3/36 ,  C08K7/14 ,  H01B3/40 ,  H01L21/56 ,  H01L21/565 ,  H01L23/295 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4382 ,  H01L2224/43848 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48221 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/485 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/3862 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/078 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A chip is attached to a substrate with wires spanning from the chip to the substrate is loaded in a heated cavity of a mold. The wire surfaces are coated with an adsorbed layer of molecules of a heterocyclic compound. A pressure chamber of the mold is loaded with a solid pellet of a packaging material including a polymerizable resin. The chamber is connected to the cavity. The vapor of resin molecules is allowed to spread from the chamber to the assembly inside the cavity during the time interval needed to heat the solid pellet for rendering it semi-liquid and to pressurize it through runners before filling the mold cavity, wherein the resin molecules arriving in the cavity are cross-linked by the adsorbed heterocyclic compound molecules into an electrically insulating at least one monolayer of polymeric structures on the wire surfaces.

Abstract translation: 将芯片连接到基板上，从芯片到基板的导线被装载在模具的加热空腔中。 线表面涂覆有杂环化合物分子的吸附层。 模具的压力室装有包括可聚合树脂的包装材料的固体颗粒。 腔室连接到腔体。 在加热固体颗粒以使其呈半液体并在填充模腔之前通过流道对其进行加压所需的时间间隔期间，允许树脂分子的蒸气从腔室扩散到腔内的组件，其中树脂分子 通过吸附的杂环化合物分子到达空腔中的电绝缘的至少一层聚合物结构在电线表面上。

公开(公告)号：US20130277816A1

公开(公告)日：2013-10-24

申请号：US13787198

申请日：2013-03-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rongwei Zhang ,  Abram Castro

IPC: H01L21/56 ,  H01L23/29

CPC classification number: H01L24/48 ,  B29C45/0001 ,  B29C45/0046 ,  B29C45/14655 ,  B29C45/14836 ,  C08K3/10 ,  C08K3/36 ,  C08K7/14 ,  H01B3/40 ,  H01L21/56 ,  H01L21/565 ,  H01L23/295 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4382 ,  H01L2224/43848 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48221 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/485 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/3862 ,  H01L2924/20752 ,  H01L2924/078 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/206

Abstract: The assembly of a chip (101) attached to a substrate (103) with wires (201) spanning from the chip to the substrate is loaded in a heated cavity (402) of a mold; the wire surfaces are coated with an adsorbed layer of molecules of a heterocyclic compound (302); a pressure chamber (404) of the mold is loaded with a solid pellet (410) of a packaging material including a polymerizable resin, the chamber being connected to the cavity; the vapor of resin molecules is allowed to spread from the chamber to the assembly inside the cavity during the time interval needed to heat the solid pellet for rendering it semi-liquid and to pressurize it through runners (403) before filling the mold cavity, whereby the resin molecules arriving in the cavity are cross-linked by the adsorbed heterocyclic compound molecules into an electrically insulating at least one monolayer of polymeric structures on the wire surfaces.

Abstract translation: 通过从芯片跨越到基板的导线（201）将附接到基板（103）的芯片（101）的组装装载到模具的加热空腔（402）中; 线表面涂覆有杂环化合物（302）的分子的吸附层; 模具的压力室（404）装载有包括可聚合树脂的包装材料的固体颗粒（410），该室连接到空腔; 在填充模具腔之前，在加热固体颗粒以使其半液体并通过流道（403）对其加压的时间间隔期间，允许树脂分子的蒸气从腔室扩散到腔内的组件，由此 通过被吸附的杂环化合物分子将到达空腔的树脂分子交联到电线表面上的绝缘的至少一个单层的聚合物结构。

公开(公告)号：US20200381390A1

公开(公告)日：2020-12-03

申请号：US16423104

申请日：2019-05-27

Applicant: Texas Instruments Incorporated

Inventor： Rongwei Zhang ,  James Huckabee ,  Vikas Gupta

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/544 ,  H01L21/78 ,  H01L21/304 ,  H01L21/48 ,  H01L21/56

Abstract: A leadless integrated circuit (IC) package includes a spaced apart plurality of lead terminals on at least two sides of the leadless IC package, and an IC die including a substrate having at least a semiconductor surface including circuitry coupled to bond pads with the bond pads having bonding features thereon. The bonding features are flip chip bonded to the plurality of lead terminals. Mold compound is above the IC die and between adjacent lead terminals. The lead terminals and the substrate both extend out to have exposed surfaces at edges of the leadless IC package, and the lead terminals also provide a back side bondable contact.

公开(公告)号：US10727085B2

公开(公告)日：2020-07-28

申请号：US14985034

申请日：2015-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yong Lin ,  Rongwei Zhang ,  Benjamin Stassen Cook ,  Abram Castro

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L25/065 ,  H01L23/13 ,  H01L23/12 ,  H01L23/15 ,  H01L23/14 ,  H01L21/50 ,  H01L21/60

Abstract: A method includes applying a die attach material to a die pad of an integrated circuit package. The die attach material is employed as a bonding material to the die pad. The method includes mounting an integrated circuit die to the die pad of the integrated circuit via the die attach material. The method includes printing an adhesion deposition material on the die attach material appearing at the interface of the integrated circuit die and the die pad of the integrated circuit package to mitigate delamination between the integrated circuit die and the die pad.

公开(公告)号：US10347508B2

公开(公告)日：2019-07-09

申请号：US15614819

申请日：2017-06-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yong Lin ,  Rongwei Zhang ,  Benjamin Stassen Cook ,  Abram Castro

IPC: H01L21/50 ,  H01L23/00 ,  H01L23/495 ,  H01L23/13 ,  H01L23/15 ,  H01L23/31 ,  H01L23/14 ,  H01L23/12 ,  H01L21/60

Abstract: A method includes applying a die attach material to a die pad of an integrated circuit. The die attach material is employed as a bonding material to the die pad. The method includes mounting an integrated circuit die to the die pad of the integrated circuit via the die attach material. The method includes printing an adhesion deposition material on the die attach material appearing at the interface of the integrated circuit die and the die pad of the integrated circuit to mitigate delamination between the integrated circuit die and the die pad.

公开(公告)号：US09780017B2

公开(公告)日：2017-10-03

申请号：US15346822

申请日：2016-11-09

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen Cook ,  Juan Alejandro Herbsommer ,  Yong Lin ,  Rongwei Zhang ,  Abram Castro ,  Matthew David Romig

IPC: H01L23/49 ,  H01L23/495 ,  H01L21/288 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/4952 ,  H01L21/2885 ,  H01L21/4821 ,  H01L21/4825 ,  H01L21/4867 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49572 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/0612 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/1511 ,  H01L2924/1711 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/0665

Abstract: A method of lead frame surface modification includes providing at least one pre-fabricated metal lead frame or package substrate (substrate) unit including a base metal having a die pad and a plurality of contact regions surrounding the die pad. An ink including a material that is a solid or a precursor for a solid that forms a solid upon a curing step or a sintering step that removes a liquid carrier is additively deposited including onto at least one of (i) a region of the die pad and (ii) at one region of at least a first of the contact regions (first contact region). The ink is sintered or cured to remove the liquid carrier so that a substantially solid ink residue remains.

公开(公告)号：US09524926B2

公开(公告)日：2016-12-20

申请号：US14848975

申请日：2015-09-09

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Juan Alejandro Herbsommer ,  Yong Lin ,  Rongwei Zhang ,  Abram Castro ,  Matthew David Romig

IPC: H01L23/49 ,  H01L23/495 ,  H01L21/288 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/4952 ,  H01L21/2885 ,  H01L21/4821 ,  H01L21/4825 ,  H01L21/4867 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49572 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/0612 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/1511 ,  H01L2924/1711 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/0665

Abstract: A method of lead frame surface modification includes providing at least one pre-fabricated metal lead frame or package substrate (substrate) unit including a base metal having a die pad and a plurality of contact regions surrounding the die pad. An ink including a material that is a solid or a precursor for a solid that forms a solid upon a curing step or a sintering step that removes a liquid carrier is additively deposited including onto at least one of (i) a region of the die pad and (ii) at one region of at least a first of the contact regions (first contact region). The ink is sintered or cured to remove the liquid carrier so that a substantially solid ink residue remains.

Abstract translation: 引线框架表面改性的方法包括提供至少一个预制金属引线框架或封装基板（基板）单元，其包括具有管芯焊盘和围绕管芯焊盘的多个接触区域的母材。 包括在固化步骤上形成固体的固体的材料或去除液体载体的烧结步骤的材料的油墨被加成沉积，其包括至少一个（i）芯片垫的区域 和（ii）在至少第一接触区域（第一接触区域）的一个区域。 油墨被烧结或固化以除去液体载体，使得残留基本上固体的油墨残余物。

公开(公告)号：US20150171046A1

公开(公告)日：2015-06-18

申请号：US14541208

申请日：2014-11-14

Applicant: Texas Instruments Incorporated

Inventor： Rongwei Zhang

IPC: H01L23/00 ,  H01L23/495

CPC classification number: H01L24/70 ,  B82Y10/00 ,  B82Y40/00 ,  H01L23/49503 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L29/0657 ,  H01L29/0676 ,  H01L2224/27318 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29169 ,  H01L2224/29193 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83385 ,  H01L2224/83894 ,  H01L2224/94 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/2064 ,  H01L2924/207 ,  H01L2924/2075 ,  H01L2224/27

Abstract: An apparatus for enhancing the thermal performance of semiconductor packages effectively. The concept of this invention is to provide silicon nanowires on the backside of an integrated circuit die to directly attach the die to the substrate, thereby improving the interface between die and substrate, and thus enhancing thermal performance and enhancing reliability by improving adhesion.

Abstract translation: 一种用于有效提高半导体封装的热性能的装置。 本发明的概念是在集成电路管芯的背面上提供硅纳米线，以直接将管芯附着于衬底，从而改善管芯与衬底之间的界面，从而通过提高粘合力来提高热性能和提高可靠性。