公开(公告)号：US20230017286A1

公开(公告)日：2023-01-19

申请号：US17373958

申请日：2021-07-13

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Rongwei Zhang ,  Chien Hao Wang ,  Bob Lee

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L21/78

摘要： A semiconductor device includes a substrate and a semiconductor die including an active surface with bond pads, an opposite inactive surface, and stepped side surfaces extending between the active surface and the inactive surface. The stepped side surfaces include a first planar surface extending from the inactive surface towards the active surface, a second planar surface extending from the active surface towards the inactive surface, and a side surface offset between the first planar surface and the second planar surface. The semiconductor device further includes an adhesive layer covering at least a portion of a surface area of the second surface and attaching the semiconductor die to the substrate.

公开(公告)号：US10366944B2

公开(公告)日：2019-07-30

申请号：US15973828

申请日：2018-05-08

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Rongwei Zhang ,  Vikas Gupta

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L21/48

摘要： Described examples include a device including a semiconductor die having a first surface with bond pads and an opposite second surface attached to a substrate by an adhesive layer covering at least a portion of the surface area of the second surface. The adhesive layer includes first zones composed of a first polymeric compound and adding up to a first portion of the surface area, and second zones composed of a second polymeric compound and adding up to a second portion of the surface area, the first zones and the second zones being contiguous. The first polymeric compound has a first modulus and the second polymeric compound has a second modulus greater than the first modulus.

公开(公告)号：US09378984B2

公开(公告)日：2016-06-28

申请号：US14520406

申请日：2014-10-22

申请人： Texas Instruments Incorporated

发明人： Rongwei Zhang ,  Abram Castro

IPC分类号： H01L21/00 ,  H01L21/56 ,  H01L23/29 ,  B29C45/14 ,  B29C45/00 ,  H01L23/00

CPC分类号： H01L24/48 ,  B29C45/0001 ,  B29C45/0046 ,  B29C45/14655 ,  B29C45/14836 ,  C08K3/10 ,  C08K3/36 ,  C08K7/14 ,  H01B3/40 ,  H01L21/56 ,  H01L21/565 ,  H01L23/295 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4382 ,  H01L2224/43848 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48221 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/485 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/3862 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/078 ,  H01L2924/00 ,  H01L2924/00012

摘要： A chip is attached to a substrate with wires spanning from the chip to the substrate is loaded in a heated cavity of a mold. The wire surfaces are coated with an adsorbed layer of molecules of a heterocyclic compound. A pressure chamber of the mold is loaded with a solid pellet of a packaging material including a polymerizable resin. The chamber is connected to the cavity. The vapor of resin molecules is allowed to spread from the chamber to the assembly inside the cavity during the time interval needed to heat the solid pellet for rendering it semi-liquid and to pressurize it through runners before filling the mold cavity, wherein the resin molecules arriving in the cavity are cross-linked by the adsorbed heterocyclic compound molecules into an electrically insulating at least one monolayer of polymeric structures on the wire surfaces.

摘要翻译： 将芯片连接到基板上，从芯片到基板的导线被装载在模具的加热空腔中。 线表面涂覆有杂环化合物分子的吸附层。 模具的压力室装有包括可聚合树脂的包装材料的固体颗粒。 腔室连接到腔体。 在加热固体颗粒以使其呈半液体并在填充模腔之前通过流道对其进行加压所需的时间间隔期间，允许树脂分子的蒸气从腔室扩散到腔内的组件，其中树脂分子 通过吸附的杂环化合物分子到达空腔中的电绝缘的至少一层聚合物结构在电线表面上。

公开(公告)号：US20130277816A1

公开(公告)日：2013-10-24

申请号：US13787198

申请日：2013-03-06

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Rongwei Zhang ,  Abram Castro

IPC分类号： H01L21/56 ,  H01L23/29

CPC分类号： H01L24/48 ,  B29C45/0001 ,  B29C45/0046 ,  B29C45/14655 ,  B29C45/14836 ,  C08K3/10 ,  C08K3/36 ,  C08K7/14 ,  H01B3/40 ,  H01L21/56 ,  H01L21/565 ,  H01L23/295 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4382 ,  H01L2224/43848 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48221 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/485 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/3862 ,  H01L2924/20752 ,  H01L2924/078 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/206

摘要： The assembly of a chip (101) attached to a substrate (103) with wires (201) spanning from the chip to the substrate is loaded in a heated cavity (402) of a mold; the wire surfaces are coated with an adsorbed layer of molecules of a heterocyclic compound (302); a pressure chamber (404) of the mold is loaded with a solid pellet (410) of a packaging material including a polymerizable resin, the chamber being connected to the cavity; the vapor of resin molecules is allowed to spread from the chamber to the assembly inside the cavity during the time interval needed to heat the solid pellet for rendering it semi-liquid and to pressurize it through runners (403) before filling the mold cavity, whereby the resin molecules arriving in the cavity are cross-linked by the adsorbed heterocyclic compound molecules into an electrically insulating at least one monolayer of polymeric structures on the wire surfaces.

摘要翻译： 通过从芯片跨越到基板的导线（201）将附接到基板（103）的芯片（101）的组装装载到模具的加热空腔（402）中; 线表面涂覆有杂环化合物（302）的分子的吸附层; 模具的压力室（404）装载有包括可聚合树脂的包装材料的固体颗粒（410），该室连接到空腔; 在填充模具腔之前，在加热固体颗粒以使其半液体并通过流道（403）对其加压的时间间隔期间，允许树脂分子的蒸气从腔室扩散到腔内的组件，由此 通过被吸附的杂环化合物分子将到达空腔的树脂分子交联到电线表面上的绝缘的至少一个单层的聚合物结构。

公开(公告)号：US20210050459A1

公开(公告)日：2021-02-18

申请号：US16539442

申请日：2019-08-13

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Steven Alfred Kummerl ,  Simon Joshua Jacobs ,  James Richard Huckabee ,  Jo Bito ,  Rongwei Zhang

IPC分类号： H01L31/0216 ,  H01L31/0203 ,  H01L31/02 ,  H01L23/00 ,  H01L31/024 ,  G02B5/20

摘要： An integrated filter optical package including an ambient light sensor that incorporates an infrared (IR) filter in an integrated circuit (IC) stacked-die configuration is provided. The integrated filter optical package incorporates an infrared (IR) coated glass layer to filter out or block IR light while allowing visible (ambient) light to pass through to a light sensitive die having a light sensor. The ambient light sensor detects an amount of visible light that passes through the IR coated glass layer and adjusts a brightness or intensity of a display screen on an electronic device accordingly so that the display screen is readable.

公开(公告)号：US10559524B1

公开(公告)日：2020-02-11

申请号：US16133117

申请日：2018-09-17

申请人： Texas Instruments Incorporated

发明人： Sadia Naseem ,  Vikas Gupta ,  Rongwei Zhang

IPC分类号： H01L21/00 ,  H01L29/00 ,  H01L23/12 ,  H01L23/495 ,  H01L23/64 ,  H01L23/00 ,  H01L21/56 ,  H01F27/28

摘要： A packaged semiconductor device includes a leadframe (LF) having a plurality of laminate-supporting pedestals. A cured first die attach (DA) material is on an outer edge of the pedestals being an ultraviolet (UV)-curing DA material having a photoinitiator or a cured B-stage DA material. A cured thermally-curing DA material is on an area of the pedestals not occupied by the UV-curing DA material. A laminate component having bond pads on a top side is mounted top side up on the plurality of pedestals.

公开(公告)号：US10083896B1

公开(公告)日：2018-09-25

申请号：US15470486

申请日：2017-03-27

申请人： Texas Instruments Incorporated

发明人： Rongwei Zhang ,  Vikas Gupta

IPC分类号： H01L21/50 ,  H01L23/495 ,  H01L23/00 ,  H01L21/48

摘要： Described examples include a device including a semiconductor die having a first surface with bond pads and an opposite second surface attached to a substrate by an adhesive layer covering at least a portion of the surface area of the second surface. The adhesive layer includes first zones composed of a first polymeric compound and adding up to a first portion of the surface area, and second zones composed of a second polymeric compound and adding up to a second portion of the surface area, the first zones and the second zones being contiguous. The first polymeric compound has a first modulus and the second polymeric compound has a second modulus greater than the first modulus.

公开(公告)号：US09780060B2

公开(公告)日：2017-10-03

申请号：US15368413

申请日：2016-12-02

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Yong Lin ,  Vikas Gupta ,  Rongwei Zhang

IPC分类号： H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/544 ,  H01L21/304

CPC分类号： H01L24/29 ,  H01L21/304 ,  H01L21/4825 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/49503 ,  H01L23/49517 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/544 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/13101 ,  H01L2224/16245 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27848 ,  H01L2224/29034 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29169 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/014 ,  H01L2924/0665

摘要： A packaged IC wherein a portion of the sidewalls of the packaged IC are solderable metal. A method of forming a packaged IC wherein a portion of the sidewalls of the wire bond pads or the flip chip pads that are exposed by sawing during singulation are solderable metal. A method of forming a packaged IC wherein all of the sidewalls of the wire bond pads or the flip chip pads that are exposed by sawing during singulation are solderable metal and a portion of sidewall of the molding compound is solderable metal.

公开(公告)号：US20170053854A1

公开(公告)日：2017-02-23

申请号：US15346822

申请日：2016-11-09

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Benjamin Stassen Cook ,  Juan Alejandro Herbsommer ,  Yong Lin ,  Rongwei Zhang ,  Abram Castro ,  Matthew David Romig

IPC分类号： H01L23/495 ,  H01L25/00 ,  H01L21/48 ,  H01L25/065

CPC分类号： H01L23/4952 ,  H01L21/2885 ,  H01L21/4821 ,  H01L21/4825 ,  H01L21/4867 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49572 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/0612 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/1511 ,  H01L2924/1711 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/0665

摘要： A method of lead frame surface modification includes providing at least one pre-fabricated metal lead frame or package substrate (substrate) unit including a base metal having a die pad and a plurality of contact regions surrounding the die pad. An ink including a material that is a solid or a precursor for a solid that forms a solid upon a curing step or a sintering step that removes a liquid carrier is additively deposited including onto at least one of (i) a region of the die pad and (ii) at one region of at least a first of the contact regions (first contact region). The ink is sintered or cured to remove the liquid carrier so that a substantially solid ink residue remains.

摘要翻译： 引线框架表面改性的方法包括提供至少一个预制金属引线框架或封装基板（基板）单元，其包括具有管芯焊盘和围绕管芯焊盘的多个接触区域的母材。 包括在固化步骤上形成固体的固体的材料或去除液体载体的烧结步骤的材料的油墨被加成沉积，其包括至少一个（i）芯片垫的区域 和（ii）在至少第一接触区域（第一接触区域）的一个区域。 油墨被烧结或固化以除去液体载体，使得残留基本上固体的油墨残余物。

公开(公告)号：US20160181183A1

公开(公告)日：2016-06-23

申请号：US14968234

申请日：2015-12-14

申请人： Texas Instruments Incorporated

发明人： Rongwei Zhang ,  Abram Castro

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC分类号： H01L23/49513 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/49541 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/562 ,  H01L24/03 ,  H01L24/04 ,  H01L24/26 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83055 ,  H01L2224/83075 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83862 ,  H01L2224/92247 ,  H01L2924/35121 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0635

摘要： The invention is directed to a method for inhibiting or preventing delamination at the interface of the die attach/mold compound and the die pad of a semiconductor device and a semiconductor device formed by such method. The method includes providing a leadframe having a top surface; coating said top surface of said leadframe with first and second silane coating; heating said silane coatings to form a pourous layer having a porosity of at least 10%; applying a die to said pourous layer; securing said die to said pourous layer by a die attaching compound; and after the curing of die attach material and wire bonding, a mold compound is applied through molding.

摘要翻译： 本发明涉及一种用于抑制或防止在芯片附着/模具化合物与半导体器件的芯片焊盘和由这种方法形成的半导体器件的界面处的分层的方法。 该方法包括提供具有顶表面的引线框架; 用第一和第二硅烷涂层涂覆所述引线框架的所述顶表面; 加热所述硅烷涂层以形成孔隙率至少为10％的凹陷层; 将模具应用于所述薄层; 通过模具附着化合物将所述模具固定到所述多孔层; 并且在固着芯片附着材料和引线接合之后，通过成型施加模塑料。