ELECTROSTATIC CHUCK WITH FEATURES FOR PREVENTING ELECTRICAL ARCING AND LIGHT-UP AND IMPROVING PROCESS UNIFORMITY
Abstract:
A substrate support for a substrate processing system includes a baseplate, a bond layer provided on the baseplate, and a ceramic layer arranged on the bond layer. The ceramic layer includes a first region and a second region located radially outward of the first region, the first region has a first thickness, the second region has a second thickness, and the first thickness is greater than the second thickness.
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