Invention Application
- Patent Title: Circuit Package
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Application No.: US15544798Application Date: 2015-03-27
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Publication No.: US20180012816A1Publication Date: 2018-01-11
- Inventor: Chien-Hua Chen , Michael W Cumbie , Stephen Farrar
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US15/23020 WO 20150327
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/56
Abstract:
A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.
Public/Granted literature
- US10276468B2 Circuit package Public/Granted day:2019-04-30
Information query
IPC分类:
