公开(公告)号：US11183437B2

公开(公告)日：2021-11-23

申请号：US16737361

申请日：2020-01-08

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Stephen Farrar

IPC: B41J2/14 ,  H01L23/31 ,  H01L23/48 ,  H01L23/00 ,  H01L21/56 ,  H01L23/29

Abstract: In some examples, a circuit package includes a packaging, and a circuit device in the packaging, where the packaging comprises a first EMC having a first coefficient of thermal expansion (CTE), and a second EMC having a second CTE higher than the first CTE. The second EMC is on the first EMC that has gelled over time.

公开(公告)号：US20190214325A1

公开(公告)日：2019-07-11

申请号：US16299538

申请日：2019-03-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Stephen Farrar

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/3135 ,  H01L21/561 ,  H01L21/565 ,  H01L24/96 ,  H01L2924/10253 ,  H01L2924/3511

Abstract: A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.

公开(公告)号：US10685898B2

公开(公告)日：2020-06-16

申请号：US16299538

申请日：2019-03-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Stephen Farrar

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/00

Abstract: A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.

公开(公告)号：US20180012816A1

公开(公告)日：2018-01-11

申请号：US15544798

申请日：2015-03-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  Stephen Farrar

IPC: H01L23/31 ,  H01L21/56

CPC classification number: H01L23/3135 ,  H01L21/561 ,  H01L21/565 ,  H01L24/96 ,  H01L2924/10253 ,  H01L2924/3511

Abstract: A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.

公开(公告)号：US10438864B2

公开(公告)日：2019-10-08

申请号：US15745743

申请日：2015-08-21

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Stephen Farrar

IPC: H01L23/552 ,  H01L23/48 ,  H01L23/373 ,  H01L23/31 ,  B41J2/16 ,  B41J2/155

Abstract: A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.

公开(公告)号：US10276468B2

公开(公告)日：2019-04-30

申请号：US15544798

申请日：2015-03-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  Stephen Farrar

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00

Abstract: A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.

公开(公告)号：US10559512B2

公开(公告)日：2020-02-11

申请号：US15763865

申请日：2015-11-16

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Stephen Farrar

IPC: B41J2/14 ,  H01L23/31 ,  H01L21/56 ,  H01L23/29

Abstract: A method of molding a circuit may include depositing a first epoxy mold compound (EMC) over a cavity, upon the first EMC gelling over a predetermined period of time, depositing a second EMC over the first EMC, and depositing a circuit in at least one of the first and second epoxy mold compounds. A circuit package may include a packaging and a circuit device in the packaging, wherein the packaging comprises a first EMC with a first CTE and a second EMC with a second CTE higher than the first CTE, the second EMC being dispensed onto the first EMC after the first EMC is allowed to gel to a predetermined degree.

公开(公告)号：US20180269125A1

公开(公告)日：2018-09-20

申请号：US15763865

申请日：2015-11-16

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Stephen Farrar

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/29 ,  B41J2/14

Abstract: A method of molding a circuit may include depositing a first epoxy mold compound (EMC) over a cavity, upon the first EMC gelling over a predetermined period of time, depositing a second EMC over the first EMC, and depositing a circuit in at least one of the first and second epoxy mold compounds. A circuit package may include a packaging and a circuit device in the packaging, wherein the packaging comprises a first EMC with a first CTE and a second EMC with a second CTE higher than the first CTE, the second EMC being dispensed onto the first EMC after the first EMC is allowed to gel to a predetermined degree.

公开(公告)号：US20180226316A1

公开(公告)日：2018-08-09

申请号：US15745743

申请日：2015-08-21

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Stephen Farrar

IPC: H01L23/31 ,  H01L23/552 ,  H01L23/48 ,  H01L23/373 ,  B41J2/155

CPC classification number: H01L23/3135 ,  B41J2/155 ,  B41J2/1623 ,  B41J2/1637 ,  B41J2202/20 ,  H01L23/3737 ,  H01L23/48 ,  H01L23/552 ,  H01L2224/96 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y10T29/49401 ,  H01L2924/00012

Abstract: A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.