Invention Application
- Patent Title: BULK ACOUSTIC WAVE FILTER DEVICE AND METHOD OF MANUFACTURING THE SAME
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Application No.: US15621552Application Date: 2017-06-13
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Publication No.: US20180013397A1Publication Date: 2018-01-11
- Inventor: Chang Hyun LIM , Moon Chul LEE , Won HAN , Tae Kyung LEE , Dae Ho KIM
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2016-0085999 20160707; KR10-2016-0159241 20161128
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H3/02 ; H03H9/10 ; H03H9/17

Abstract:
A bulk acoustic wave filter device includes a substrate, a lower electrode on the substrate, a piezoelectric layer covering at least a portion of the lower electrode, and an upper electrode covering at least a portion of the piezoelectric layer. The upper electrode has a density reduction layer disposed on at least a portion thereof, except a central portion of a resonance region of the bulk acoustic wave filter device that deforms and vibrates with the piezoelectric layer during activation of the piezoelectric layer. The density reduction layer has a density lower than a density of other portions of the upper electrode.
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