Invention Application
- Patent Title: Heating Layer For Film Removal
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Application No.: US15716700Application Date: 2017-09-27
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Publication No.: US20180016028A1Publication Date: 2018-01-18
- Inventor: Daniel J. Kovach , Gary E. Georgeson , Robert J. Miller , Jeffrey D. Morgan , Diane Rawlings
- Applicant: The Boeing Company
- Main IPC: B64D45/02
- IPC: B64D45/02 ; B29C63/00 ; B32B43/00 ; H01B5/00 ; C09J7/02 ; C08K3/08 ; B32B37/12

Abstract:
Embodiments of the presently disclosed system include a thin thermoplastic or thermosetting polymer film loaded with non-polymeric inclusions that are susceptible to heating under a time-varying magnetic field. Insertion of this additional heating layer into a structural or semi-structural heterogeneous laminate provides an “on-demand” de-bonding site for laminate deconstruction. For example, in some embodiments when the heating layer is inserted between a cured Carbon-Fiber Reinforced Plastic (CFRP) layer and a Polymeric/Metallic film stackup layer, the heating layer can be selectively heated above its softening point (e.g., by using energy absorbed from a locally-applied time-varying magnetic field) to allow for ease of applique separation from the CFRP layer.
Public/Granted literature
- US10940958B2 Heating layer for film removal Public/Granted day:2021-03-09
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