Invention Grant
- Patent Title: Heating layer for film removal
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Application No.: US15716700Application Date: 2017-09-27
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Publication No.: US10940958B2Publication Date: 2021-03-09
- Inventor: Daniel J Kovach , Gary E Georgeson , Robert J Miller , Jeffrey D Morgan , Diane Rawlings
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Parsons Behle & Latimer
- Main IPC: B32B43/00
- IPC: B32B43/00 ; B64D45/02 ; H01B5/00 ; B29C63/00 ; C08K3/08 ; B32B37/12 ; B32B38/10 ; H05B6/10 ; H05B6/02 ; C08L11/00

Abstract:
Embodiments of the presently disclosed system include a thin thermoplastic or thermosetting polymer film loaded with non-polymeric inclusions that are susceptible to heating under a time-varying magnetic field. Insertion of this additional heating layer into a structural or semi-structural heterogeneous laminate provides an “on-demand” de-bonding site for laminate deconstruction. For example, in some embodiments when the heating layer is inserted between a cured Carbon-Fiber Reinforced Plastic (CFRP) layer and a Polymeric/Metallic film stackup layer, the heating layer can be selectively heated above its softening point (e.g., by using energy absorbed from a locally-applied time-varying magnetic field) to allow for ease of applique separation from the CFRP layer.
Public/Granted literature
- US20180016028A1 Heating Layer For Film Removal Public/Granted day:2018-01-18
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