- 专利标题： INFRARED CUT FILTER, KIT, AND SOLID-STATE IMAGING DEVICE
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申请号： US15717025申请日： 2017-09-27
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公开(公告)号： US20180017720A1公开(公告)日： 2018-01-18
- 发明人: Keisuke ARIMURA , Kazuto SHIMADA , Daisuke SASAKI , Yuki HIRAI , Tokihiko MATSUMURA
- 申请人： FUJIFILM Corporation
- 申请人地址： JP Tokyo
- 专利权人： FUJIFILM Corporation
- 当前专利权人： FUJIFILM Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2015-072578 20150331
- 主分类号： G02B5/20
- IPC分类号： G02B5/20 ; C09B23/16 ; C09B57/00 ; G02B5/00 ; H01L27/146
摘要：
To provide an infrared cut filter having a wide view angle and excellent infrared shieldability, a kit for manufacturing the infrared cut filter, and a solid-state imaging device. An infrared cut filter has: a copper-containing transparent layer 1. The copper-containing transparent layer 1 further contains an infrared absorbing agent, or an infrared absorbing agent-containing layer 2 is further provided.
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