Abstract:
The present invention relates to a thermal conductive layer that includes at least one filler, has a thermal diffusivity of 5.0×10−7 m2 s−1 or more, and has a volume resistivity of 1.0×1011 Ω·cm or more. Further, the present invention relates to a photosensitive layer to which the thermal conductive layer is applied, a photosensitive composition, a manufacturing method for a thermal conductive layer, and a laminate and a semiconductor device.
Abstract:
An infrared absorbing composition which is used for forming an infrared cut filter in a solid image pickup element having the infrared cut filter includes at least one infrared absorber having an absorption maximum at a wavelength of 650 nm or longer which is selected from polymethine colorants.
Abstract:
Provided is a coloring composition with which a film capable of allowing transmission of infrared light in a state where noise generated from visible light is small can be formed. In addition, also provided are a film, a color filter, a pattern forming method, a method for manufacturing a color filter, a solid image pickup element, and an infrared sensor in which the coloring composition is used. The coloring composition includes a coloring material that shields light in a visible range; and an infrared absorber. It is preferable that the coloring material that shields light in the visible range includes two or more chromatic colorants and that a combination of the two or more chromatic colorants forms black. Alternatively, it is preferable that the coloring material that shields light in the visible range includes an organic black colorant. It is preferable that the organic black colorant is at least one selected from the group consisting of a perylene compound and a bisbenzofuranone compound.
Abstract:
An infrared ray absorbing composition kit comprises: a composition containing a copper compound or pigment having a maximum absorption wavelength in the wavelength range of 700 nm to 1000 nm; and a composition containing a metal oxide having a maximum absorption wavelength in the wavelength range of 800 nm to 2000 nm.
Abstract:
A curable resin composition, for forming a first optical member of an optical member set, the optical member having the first optical member and a second optical member covered with the first optical member, the first optical member being formed by curing a siloxane resin, comprising: a siloxane resin, a surfactant, and a solvent, the siloxane resin and the surfactant being contained in the solvent, the surfactant having a polyoxyalkylene structure, the siloxane resin being defined in 65% by mass to 100% by mass thereof having a particular polysilsesquioxane structure.
Abstract:
There are provided a method of manufacturing a cured film, including a first exposure step of exposing a part of a photocurable film formed from a photocurable resin composition, a development step of developing the photocurable film after the exposure with a developing solution to obtain a pattern, and a second exposure step of exposing the pattern with light including light having a wavelength different from a wavelength of light used in the first exposure step, where the photocurable resin composition has a specific constitution, a photocurable resin composition that is used in the method of manufacturing the cured film, a method of manufacturing a laminate including the method of manufacturing a cured film, and a method of manufacturing an electronic device, which includes the method of manufacturing the cured film.
Abstract:
To provide an infrared cut filter that has a wide view angle and excellent infrared shieldability and in which the generation of defects is suppressed, and a solid-state imaging device. An infrared cut filter has: a transparent base 1; an infrared absorbing film 2 that contains an infrared absorbing agent; and a dielectric multi-layer film 3, the infrared absorbing film 2 has a maximum absorption wavelength in a wavelength region of 600 nm or greater, and a ratio B/A of, to absorbance A at the maximum absorption wavelength before the infrared absorbing film 2 is dipped in at least one organic solvent selected from propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, methyl 3-methoxypropionate, ethyl lactate, acetone, and ethanol, absorbance B at the wavelength at which the absorbance A is measured after the infrared absorbing film 2 is dipped in the organic solvent for 2 minutes at 25° C. is 0.9 or greater.
Abstract:
A laminate includes a first area formed by applying a first composition and a second area formed by applying a second composition on a surface of the first area, and a difference between refractive indexes of the first area and the second area is 0.5 or greater, and the first areas and the second areas are alternately laminated.
Abstract:
There is provided a curable resin composition which is capable of being coated on a solid-state imaging device substrate and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, a production method of image sensor chip comprising a step of coating the curable resin composition on a solid-state imaging device substrate to form a dye-containing layer, and a step of adhering a glass substrate having an infrared ray reflecting film onto the dye-containing layer, and an image sensor chip comprising a solid-state imaging device substrate and a dye-containing layer composed of the curable resin composition.
Abstract:
According to an exemplary embodiment of the present invention, there is provided a curable resin composition comprising a dye having a maximum absorption wavelength in a range of 600 nm to 820 nm, and being capable of forming a high refractive index layer with a refractive index ranging from 1.65 to 2.00.