Invention Application
- Patent Title: APPARATUS AND METHOD FOR MEASUREMENT OF THE THERMAL PERFORMANCE OF AN ELECTROSTATIC WAFER CHUCK
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Application No.: US15792596Application Date: 2017-10-24
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Publication No.: US20180047607A1Publication Date: 2018-02-15
- Inventor: Matthew J. Busche , Vijay D. Parkhe , Michael R. Rice
- Applicant: APPLIED MATERIALS, INC.
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; G01N21/95
Abstract:
An apparatus and method are described for measuring the thermal performance of a wafer chuck, such as an electrostatic chuck. In one example, the apparatus ha a chamber, a base to support a wafer chuck in the chamber, a heater to heat the chuck, a window through the exterior of the chamber, and an infrared imaging system to measure the temperature of the chuck while the chuck is heated.
Public/Granted literature
- US10395964B2 Apparatus and method for measurement of the thermal performance of an electrostatic wafer chuck Public/Granted day:2019-08-27
Information query
IPC分类:
