- 专利标题: PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
-
申请号: US15682770申请日: 2017-08-22
-
公开(公告)号: US20180054891A1公开(公告)日: 2018-02-22
- 发明人: Teruyuki ISHIHARA , Hiroyuki BAN , Haiying MEI
- 申请人: IBIDEN CO., LTD.
- 申请人地址: JP Ogaki
- 专利权人: IBIDEN CO., LTD.
- 当前专利权人: IBIDEN CO., LTD.
- 当前专利权人地址: JP Ogaki
- 优先权: JP2016-161868 20160822
- 主分类号: H05K1/11
- IPC分类号: H05K1/11 ; H05K1/02 ; H05K1/03 ; H05K1/18 ; H05K3/02 ; H05K3/06 ; H05K3/46 ; H05K3/40
摘要:
A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and second conductor pads on second surface side of the laminate, and a solder resist layer interposed between the support plate and laminate and having openings formed such that the openings are exposing the first pads. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side, and a via conductor structure penetrating from the first surface to the second surface of the laminate such that the via structure includes via conductors formed in the insulating layer and tapering from the first surface side toward second surface side of the laminate, and the second pads are protruding from the second surface of the laminate.
信息查询