公开(公告)号：US20180054891A1

公开(公告)日：2018-02-22

申请号：US15682770

申请日：2017-08-22

申请人： IBIDEN CO., LTD.

发明人： Teruyuki ISHIHARA ,  Hiroyuki BAN ,  Haiying MEI

IPC分类号： H05K1/11 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/02 ,  H05K3/06 ,  H05K3/46 ,  H05K3/40

CPC分类号： H05K1/113 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/181 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/181 ,  H05K3/007 ,  H05K3/025 ,  H05K3/06 ,  H05K3/205 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/465 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/10674 ,  H01L2924/00012

摘要： A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and second conductor pads on second surface side of the laminate, and a solder resist layer interposed between the support plate and laminate and having openings formed such that the openings are exposing the first pads. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side, and a via conductor structure penetrating from the first surface to the second surface of the laminate such that the via structure includes via conductors formed in the insulating layer and tapering from the first surface side toward second surface side of the laminate, and the second pads are protruding from the second surface of the laminate.

公开(公告)号：US20180054890A1

公开(公告)日：2018-02-22

申请号：US15682721

申请日：2017-08-22

申请人： IBIDEN CO., LTD.

发明人： Teruyuki ISHIHARA ,  Hiroyuki BAN ,  Haiying MEI

IPC分类号： H05K1/11 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/02 ,  H05K3/06 ,  H05K3/46 ,  H05K3/40

CPC分类号： H05K1/113 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/181 ,  H05K3/025 ,  H05K3/06 ,  H05K3/243 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/465 ,  H05K3/4682 ,  H05K2201/0338 ,  H05K2201/10378 ,  Y02P70/611

摘要： A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and first via conductors on second surface side of the laminate, and a solder resist layer interposed between the plate and the laminate and having openings formed such that the openings are exposing the first pads. The laminate has first surface on the first surface side and second surface on the second surface side on the opposite side and includes a first resin insulating layer forming the second surface of the laminate, and the first conductors are formed through the first insulating layer such that the first vias are tapering from the first surface side toward the second surface side of the laminate and have end surfaces recessed from the second surface of the laminate on the second surface side of the laminate.

公开(公告)号：US20170064825A1

公开(公告)日：2017-03-02

申请号：US15252264

申请日：2016-08-31

申请人： IBIDEN CO., LTD.

发明人： Teruyuki ISHIHARA ,  Haiying MEI ,  Hiroyuki BAN

IPC分类号： H05K1/11 ,  H05K1/03 ,  H05K1/18 ,  H05K1/02 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K1/113 ,  H01L2224/16225 ,  H01L2224/48227 ,  H05K1/0298 ,  H05K1/0373 ,  H05K1/183 ,  H05K3/0097 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4647 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09118 ,  H05K2201/09136 ,  H05K2201/096 ,  H05K2203/025 ,  H05K2203/1189 ,  H05K2203/1476 ,  H05K2203/1536 ,  H05K2203/308

摘要： A printed wiring board includes a first circuit substrate having first and second surfaces, and a second circuit substrate having third and fourth surfaces such that the first substrate is laminated on the third surface and that the first and third surfaces are opposing each other. The second substrate includes a conductor layer, a first insulating layer including reinforcing material and formed on the conductor layer, and mounting via conductors formed in the first insulating layer and connected to the conductor layer such that the second substrate has a mounting area on the third surface and that the mounting via conductors have via bottoms forming pads positioned to mount an electronic component in the mounting area, and the first substrate includes an insulating layer which does not contain reinforcing material and has an opening through the insulating layer and exposing the via bottoms forming the pads in the mounting area.

摘要翻译： 印刷电路板包括具有第一和第二表面的第一电路基板和具有第三和第四表面的第二电路基板，使得第一基板层压在第三表面上，并且第一和第三表面彼此相对。 第二基板包括导体层，包括增强材料并形成在导体层上的第一绝缘层，并且经由形成在第一绝缘层中并连接到导体层的导体安装，使得第二基板在第三绝缘层上具有安装区域 并且所述安装通孔导体具有通孔底部形成用于将电子部件安装在所述安装区域中的焊盘，并且所述第一基板包括绝缘层，所述绝缘层不包含增强材料并且具有穿过所述绝缘层的开口并暴露所述通孔底部 在安装区域中形成焊盘。

公开(公告)号：US20190139877A1

公开(公告)日：2019-05-09

申请号：US16235829

申请日：2018-12-28

申请人： IBIDEN CO., LTD.

发明人： Teruyuki ISHIHARA ,  Hiroyuki BAN ,  Haiying MEI

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L21/768

摘要： A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on a first surface side of the laminate and second conductor pads on a second surface side of the laminate, and a solder resist layer interposed between the support plate and the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side with respect to the first surface of the laminate, the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces recessed from the second surface of the laminate respectively.

公开(公告)号：US20170317017A1

公开(公告)日：2017-11-02

申请号：US15581253

申请日：2017-04-28

申请人： IBIDEN CO., LTD.

发明人： Teruyuki ISHIHARA ,  Haiying MEI ,  Hiroyuki BAN

IPC分类号： H01L23/498 ,  H01L21/48 ,  H05K1/18 ,  H01L21/52 ,  H01L23/00

CPC分类号： H01L23/49822 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/52 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/81005 ,  H01L2224/81444 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15313 ,  H01L2924/1533 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/37001 ,  H05K1/181 ,  H05K3/243 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0338 ,  H05K2201/10378 ,  Y02P70/611 ,  H01L2924/014 ,  H01L2924/00014

摘要： A printed wiring board includes a support plate, and a build-up wiring layer including resin insulating layers and conductor layers and having a first surface and a second surface on the opposite side with respect to the first surface such that the support plate is positioned on the first surface of the build-up wiring layer. The resin insulating layers in the build-up wiring layer include a first resin insulating layer that forms the second surface of the build-up wiring layer, and the build-up wiring layer includes first conductor pads embedded in the first resin insulating layer such that each of the first conductor pads has an exposed surface exposed from the second surface of the build-up wiring layer.

公开(公告)号：US20170127517A1

公开(公告)日：2017-05-04

申请号：US15339057

申请日：2016-10-31

申请人： IBIDEN CO., LTD.

发明人： Teruyuki ISHIHARA ,  Hiroyuki BAN ,  Haiying MEI

IPC分类号： H05K1/11 ,  H05K3/06 ,  H05K3/40 ,  H05K1/05 ,  H05K3/46

摘要： A printed wiring board includes a multilayer body, a first wiring layer formed on first surface of the body and including first pads, a second wiring layer embedded into second surface of the body and including second and third pads, conductor posts formed on the third pads, and via conductors formed in the body and having diameter reducing toward the second surface of the body. Each third pad has metal foil formed thereon such that each post is formed on the foil, the second wiring layer is formed such that the second pads are positioned to connect an electronic component in central portion of the second surface of the body and the third pads are positioned to connect another board in outer edge portion of the second surface of the body, and the second pads are formed such that each second pad has exposed surface recessed from the second surface.

公开(公告)号：US20170064835A1

公开(公告)日：2017-03-02

申请号：US15252286

申请日：2016-08-31

申请人： IBIDEN CO., LTD.

发明人： Teruyuki ISHIHARA ,  Haiying MEI ,  Hiroyuki BAN

IPC分类号： H05K1/18 ,  H05K1/03 ,  H05K3/46 ,  H05K3/00 ,  H01L23/538 ,  H01L21/48 ,  H01L21/683 ,  H05K1/11 ,  H05K1/02

CPC分类号： H05K1/183 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1533 ,  H05K3/0097 ,  H05K3/205 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/09127 ,  H01L2924/00014

摘要： A printed wiring board includes a first circuit substrate having a first surface and a second surface on the opposite side, and a second circuit substrate having a third surface and a fourth surface on the opposite side such that the first circuit substrate is laminated on the third surface and that the first surface and the third surface are opposing each other. The second circuit substrate has a mounting area on the third surface and includes pads positioned to mount an electronic component in the mounting area and a connection wire structure connected to the pads, and the first circuit substrate includes through-hole conductors extending from the first surface to the second surface and connected to the pads through the connection wire structure and has an opening portion formed through the first circuit substrate such that the opening portion is exposing the pads formed in the mounting area.

摘要翻译： 一种印刷电路板包括具有第一表面和相对侧的第二表面的第一电路基板，以及第二电路基板，其具有在相对侧上的第三表面和第四表面，使得第一电路基板层叠在第三 并且第一表面和第三表面彼此相对。 第二电路基板在第三表面上具有安装区域，并且包括定位成将电子部件安装在安装区域中的焊盘和连接到焊盘的连接线结构，并且第一电路基板包括从第一表面延伸的通孔导体 通过所述连接线结构连接到所述焊盘，并且具有通过所述第一电路基板形成的开口部，使得所述开口部露出形成在所述安装区域中的焊盘。

公开(公告)号：US20190327830A1

公开(公告)日：2019-10-24

申请号：US16502170

申请日：2019-07-03

申请人： IBIDEN CO., LTD.

发明人： Teruyuki ISHIHARA ,  Hiroyuki BAN ,  Haiying MEI

IPC分类号： H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H05K3/00 ,  H05K3/46

摘要： A printed wiring board includes a laminate including first conductor pads on first surface side of the laminate and second conductor pads on second surface side of the laminate, and a solder resist layer formed on the first surface side of the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has first surface on the first surface side and second surface on the second surface side on the opposite side with respect to the first surface of the laminate, and the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces exposed from the second surfaces of the laminate respectively and that the surfaces of the second conductor pads are protruding from the second surface of the laminate.

公开(公告)号：US20180054888A1

公开(公告)日：2018-02-22

申请号：US15681948

申请日：2017-08-21

申请人： IBIDEN CO., LTD.

发明人： Teruyuki ISHIHARA ,  Hiroyuki BAN ,  Haiying MEI

IPC分类号： H05K1/02

CPC分类号： H05K1/0284 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/15174 ,  H05K1/0296 ,  H05K3/007 ,  H05K3/205 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/10674

摘要： A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on a first surface side of the laminate and second conductor pads on a second surface side of the laminate, and a solder resist layer interposed between the support plate and the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side with respect to the first surface of the laminate, the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces exposed from the second surface of the laminate respectively.

公开(公告)号：US20170263571A1

公开(公告)日：2017-09-14

申请号：US15453964

申请日：2017-03-09

申请人： IBIDEN CO., LTD.

发明人： Teruyuki ISHIHARA ,  Hiroyuki BAN ,  Kosuke IKEDA ,  Haiying MEI

IPC分类号： H01L23/552 ,  H01L21/768 ,  H01L23/053 ,  H01L23/48

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L21/568 ,  H01L21/76895 ,  H01L21/76898 ,  H01L23/053 ,  H01L23/295 ,  H01L23/481 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16237 ,  H01L2224/81005 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00014

摘要： An electronic component built-in substrate includes an insulating substrate having a through hole and an inner wall surrounding the through hole, an electronic component accommodated in the through hole of the substrate, a sealing member filling the through hole such that the sealing member is covering the electronic component in the through hole of the substrate and exposing a terminal of the electronic component on a first side of the substrate, and a shield layer structure including a first metal film and a second metal film formed such that the first metal film is formed on the inner wall of the substrate and surrounding the through hole of the substrate and that the second metal film is formed on a second side of the substrate on the opposite side with respect to the first side and covering an opening of the through hole on the second side of the substrate.