公开(公告)号：US20170064825A1

公开(公告)日：2017-03-02

申请号：US15252264

申请日：2016-08-31

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Haiying MEI ,  Hiroyuki BAN

IPC: H05K1/11 ,  H05K1/03 ,  H05K1/18 ,  H05K1/02 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/113 ,  H01L2224/16225 ,  H01L2224/48227 ,  H05K1/0298 ,  H05K1/0373 ,  H05K1/183 ,  H05K3/0097 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4647 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09118 ,  H05K2201/09136 ,  H05K2201/096 ,  H05K2203/025 ,  H05K2203/1189 ,  H05K2203/1476 ,  H05K2203/1536 ,  H05K2203/308

Abstract: A printed wiring board includes a first circuit substrate having first and second surfaces, and a second circuit substrate having third and fourth surfaces such that the first substrate is laminated on the third surface and that the first and third surfaces are opposing each other. The second substrate includes a conductor layer, a first insulating layer including reinforcing material and formed on the conductor layer, and mounting via conductors formed in the first insulating layer and connected to the conductor layer such that the second substrate has a mounting area on the third surface and that the mounting via conductors have via bottoms forming pads positioned to mount an electronic component in the mounting area, and the first substrate includes an insulating layer which does not contain reinforcing material and has an opening through the insulating layer and exposing the via bottoms forming the pads in the mounting area.

Abstract translation: 印刷电路板包括具有第一和第二表面的第一电路基板和具有第三和第四表面的第二电路基板，使得第一基板层压在第三表面上，并且第一和第三表面彼此相对。 第二基板包括导体层，包括增强材料并形成在导体层上的第一绝缘层，并且经由形成在第一绝缘层中并连接到导体层的导体安装，使得第二基板在第三绝缘层上具有安装区域 并且所述安装通孔导体具有通孔底部形成用于将电子部件安装在所述安装区域中的焊盘，并且所述第一基板包括绝缘层，所述绝缘层不包含增强材料并且具有穿过所述绝缘层的开口并暴露所述通孔底部 在安装区域中形成焊盘。

公开(公告)号：US20160113120A1

公开(公告)日：2016-04-21

申请号：US14886544

申请日：2015-10-19

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA

IPC: H05K3/02 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K3/0097 ,  H05K3/421 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2203/1536 ,  Y10T29/49155

Abstract: A method for manufacturing a printed wiring board includes forming on carrier a laminate including a second metal foil, a resin layer laminated on the second foil and a first metal foil laminated on the resin layer, irradiating laser upon the first foil such that opening is formed through the first foil and resin layer and exposes surface of the second foil at bottom, plating the first foil such that a via conductor is formed in the opening and a first conductor layer including the first foil and an electroplating film is formed on surface of the resin layer, removing the carrier from the laminate, patterning the first conductor layer on the resin layer, and patterning the second foil such that a second conductor layer including the second foil is formed on opposite surface of the resin layer. The second foil has thickness greater than thickness of the first foil.

Abstract translation: 一种印刷电路板的制造方法，其特征在于，在载体上形成层叠了第二金属箔，层叠在第二箔上的树脂层和层叠在树脂层上的第一金属箔的层叠体，在第一箔上照射激光使得形成开口 通过第一箔和树脂层并在底部暴露第二箔的表面，对第一箔进行镀覆，使得在开口中形成通孔导体，并且在第一箔和表面上形成包括第一箔和电镀膜的第一导体层 树脂层，从层压体中除去载体，图案化树脂层上的第一导体层，并对第二箔进行构图，使得包含第二箔的第二导体层形成在树脂层的相对表面上。 第二箔的厚度大于第一箔的厚度。

公开(公告)号：US20150114690A1

公开(公告)日：2015-04-30

申请号：US14522768

申请日：2014-10-24

Applicant: IBIDEN Co., Ltd.

Inventor： Teruyuki ISHIHARA ,  Michimasa Takahashi ,  Takashi Kariya

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/10 ,  H05K1/11

CPC classification number: H05K3/4691 ,  H05K2201/0187 ,  H05K2203/308

Abstract: A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer on first surface sides of the flexible and non-flexible substrates, a second wiring layer on second surface sides of the flexible and non-flexible substrates, a first insulating layer covering the first sides of the flexible and non-flexible substrates and having an opening exposing a portion of the first side of the flexible substrate, and a second insulating layer covering the second sides of the flexible and non-flexible substrates and having an opening exposing a portion of the second side of the flexible substrate. The first wiring layer includes first conductor pattern on the first side of the flexible substrate, and the second wiring layer includes second conductor pattern extending across the second sides of the flexible and non-flexible substrates.

Abstract translation: 柔性刚性布线板包括柔性基板，非柔性基板，其定位成使得非柔性基板在柔性基板的水平方向上延伸;柔性基板和非柔性基板的第一表面侧上的第一布线层 ，在所述柔性和非柔性基板的第二表面侧上的第二布线层，覆盖所述柔性和非柔性基板的第一侧的第一绝缘层，并且具有暴露柔性基板的第一侧的一部分的开口， 以及覆盖所述柔性和非柔性基板的第二侧面的第二绝缘层，并且具有暴露所述柔性基板的第二侧的一部分的开口。 所述第一布线层包括在所述柔性基板的第一侧上的第一导体图案，并且所述第二布线层包括延伸穿过所述柔性和非柔性基板的第二侧的第二导体图案。

公开(公告)号：US20130305530A1

公开(公告)日：2013-11-21

申请号：US13945332

申请日：2013-07-18

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Hidetoshi NOGUCHI

IPC: H05K3/46

CPC classification number: H05K3/46 ,  H05K1/183 ,  H05K3/3452 ,  H05K3/4691 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09127 ,  H05K2203/107 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A wiring board having an insulation layer, and a buildup structure formed on the insulation layer and including insulation layers. The insulation layer and the buildup structure form a board structure in which a cavity portion having an opening on a surface of the buildup structure on the opposite side of the insulation layer is formed. The cavity portion is extending through one or more of the insulation layers in the buildup structure and has a groove portion formed on the bottom surface of the cavity portion along a wall surface of the cavity portion. The board structure composed of the insulation layer and the buildup structure has a pad formed on the bottom surface of the cavity portion in a position farther from the wall surface of the cavity portion than the groove portion.

Abstract translation: 具有绝缘层的布线板和形成在绝缘层上并包括绝缘层的堆积结构。 绝缘层和积层结构形成板结构，其中形成在绝缘层相对侧上的积层结构的表面上具有开口的空腔部分。 空腔部分延伸穿过积聚结构中的一个或多个绝缘层，并且具有沿着空腔部分的壁表面形成在空腔部分的底表面上的凹槽部分。 由绝缘层和积层结构构成的板结构具有在空腔部的底面上形成有比凹槽部更远离空腔部的壁面的位置的垫。

公开(公告)号：US20180053715A1

公开(公告)日：2018-02-22

申请号：US15681695

申请日：2017-08-21

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Hiroyuki Ban ,  Haiying Mei

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L21/768

CPC classification number: H01L23/49822 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76885 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/1533 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on a first surface side of the laminate and second conductor pads on a second surface side of the laminate, and a solder resist layer interposed between the support plate and the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side with respect to the first surface of the laminate, the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces recessed from the second surface of the laminate respectively.

公开(公告)号：US20170215282A1

公开(公告)日：2017-07-27

申请号：US15414918

申请日：2017-01-25

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K3/06 ,  H05K3/46 ,  H05K1/03

CPC classification number: H05K1/115 ,  H05K1/0313 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/061 ,  H05K3/4038 ,  H05K3/429 ,  H05K3/4647 ,  H05K3/4682 ,  H05K2201/096 ,  H05K2203/0597

Abstract: A printed wiring board includes a conductor layer including a conductor circuit, a resin insulating layer formed on the conductor layer and having a via opening reaching to the conductor circuit of the conductor layer, and a via conductor formed in the via opening of the resin insulating layer such that the via conductor is connecting to the conductor circuit of the conductor layer. The conductor circuit of the conductor layer has a first conductor portion and a second conductor portion integrally formed such that the first conductor portion is connected to the via opening of the resin insulating layer, that the second conductor portion is surrounding the first conductor portion and that the first conductor portion has a thickness which is greater than a thickness of the second conductor portion.

公开(公告)号：US20170196084A1

公开(公告)日：2017-07-06

申请号：US15398778

申请日：2017-01-05

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H05K1/11 ,  H05K1/112 ,  H05K1/116 ,  H05K1/14 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/429 ,  H05K2201/041 ,  H05K2201/095 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09827

Abstract: A printed wiring board includes a first insulating layer, a second conductor layer including first and second circuits, a second insulating layer covering the second conductor layer on the first insulating layer, a third conductor layer including first and second circuits, a third insulating layer covering the third conductor layer on the second insulating layer, a fourth conductor layer including first circuit, a second via conductor connecting the first circuits in the second and third conductor layers through the second insulating layer, and a first skip via conductor penetrating through the second circuit in the third conductor layer and connecting the second circuit in the second conductor layer and the first circuit in the fourth conductor layer through the second and third insulating layers. The second and third conductor layers are formed such that the second conductor layer has thickness t2 larger than thickness t3 of the third conductor layer.

公开(公告)号：US20150257269A1

公开(公告)日：2015-09-10

申请号：US14636780

申请日：2015-03-03

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Michimasa Takahashi

IPC: H05K1/14

CPC classification number: H05K3/0097 ,  H05K2203/0169 ,  H05K2203/167

Abstract: A combined wiring board includes multiple metal frames arrayed in a first direction, and multiple wiring boards bonded to the metal frames such that the wiring boards are arrayed in the first direction. The metal frames directly or indirectly engage with the wiring boards such that each of the metal frames is positioned between two adjacent wiring boards of the wiring boards.

Abstract translation: 组合布线板包括沿第一方向排列的多个金属框架，以及多个接线到金属框架的布线板，使得布线板沿第一方向排列。 金属框架直接或间接地与布线板接合，使得每个金属框架位于布线板的两个相邻布线板之间。

公开(公告)号：US20150136453A1

公开(公告)日：2015-05-21

申请号：US14542721

申请日：2014-11-17

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Michimasa TAKAHASHI

IPC: H05K7/14 ,  H05K1/02 ,  H05K3/36 ,  H05K1/14

CPC classification number: H05K3/368 ,  H05K1/0228 ,  H05K1/0271 ,  H05K1/142 ,  H05K1/144 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/2018 ,  H05K2201/2072 ,  H05K2203/0169 ,  Y10T29/49126

Abstract: A combined wiring board includes a wiring board set having multiple wiring boards and one or more adhesive agent portions such that the wiring boards are connected each other by the adhesive agent portion or adhesive agent portions, and a metal frame having an accommodation opening portion formed to accommodate the wiring board set such that the wiring board set is positioned in the accommodation opening portion of the metal frame.

Abstract translation: 组合布线板包括具有多个布线板和一个或多个粘合剂部分的布线板组，使得布线板通过粘合剂部分或粘合剂部分彼此连接，并且金属框架具有容纳开口部分，形成为 容纳布线板，使得布线板组位于金属框架的容纳开口部分中。

公开(公告)号：US20190139877A1

公开(公告)日：2019-05-09

申请号：US16235829

申请日：2018-12-28

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Hiroyuki BAN ,  Haiying MEI

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L21/768

Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on a first surface side of the laminate and second conductor pads on a second surface side of the laminate, and a solder resist layer interposed between the support plate and the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side with respect to the first surface of the laminate, the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces recessed from the second surface of the laminate respectively.