- 专利标题: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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申请号: US15472720申请日: 2017-03-29
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公开(公告)号: US20180061843A1公开(公告)日: 2018-03-01
- 发明人: Dong-Won Kim , Bong-Tae Park , Ho-Jun Seong , Jae-Hwang Sim , Jung-Hoon Jun
- 申请人: Samsung Electronics Co., Ltd.
- 优先权: KR10-2016-0107708 20160824
- 主分类号: H01L27/1157
- IPC分类号: H01L27/1157 ; H01L21/28 ; H01L21/3213 ; H01L21/311 ; H01L21/8234 ; H01L21/265 ; H01L21/027 ; H01L27/11573 ; H01L29/49 ; H01L27/11524 ; H01L27/11534
摘要:
A method of forming a nonvolatile memory device includes forming first, second, and third gate structures, with the second and third gate structures including first and second spacer structures formed on a sidewall of the second gate structure and sidewalls of the third gate structure. Impurity regions are formed through ion implantation and the first spacer structure shields the second and third gate structures during ion implantation. The second spacer structure defines resulting impurity regions.
公开/授权文献
- US09905569B1 Semiconductor device and method of manufacturing the same 公开/授权日:2018-02-27
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