- 专利标题： Conductive Pad Structure for Hybrid Bonding and Methods of Forming Same
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申请号： US15800491申请日： 2017-11-01
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公开(公告)号： US20180068965A1公开(公告)日： 2018-03-08
- 发明人: Sheng-Chau Chen , Shih Pei Chou , Yen-Chang Chu , Cheng-Hsien Chou , Chih-Hui Huang , Yeur-Luen Tu
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/321 ; H01L21/324 ; H01L21/311 ; H01L25/065 ; H01L27/146
摘要：
A representative device includes a patterned opening through a layer at a surface of a device die. A liner is disposed on sidewalls of the opening and the device die is patterned to extend the opening further into the device die. After patterning, the liner is removed. A conductive pad is formed in the device die by filling the opening with a conductive material.
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