A laser machining device includes a laser generating component, a light moving component, a gas source and a laser machining scrap removal device. The laser generating component generates a laser beam passing through an optical channel. The light moving component is positioned along a path of the laser beam to make the laser beam move along an annular machining path. The laser machining scrap removal device utilizes an internal flow path of the nozzle to increase the speed of the ejected airflow and reduce the pressure of a suction area. The gas source provides an airflow and is located on the laser machining scrap removal device in communication with the internal flow path of the nozzle. The laser machining scrap removal device induces suction on the laser processed area to assist in laser cutting/drilling processes by removing large areas of scrap, thereby improving the production speed and hole quality.