Invention Application
- Patent Title: Package cooled with cooling fluid and comprising shielding layer
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Application No.: US15710852Application Date: 2017-09-21
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Publication No.: US20180082925A1Publication Date: 2018-03-22
- Inventor: Andreas GRASSMANN , Wolfram HABLE , Juergen HOEGERL , Ivan NIKITIN , Achim STRASS
- Applicant: Infineon Technologies AG
- Priority: DE102016117843.8 20160921
- Main IPC: H01L23/42
- IPC: H01L23/42 ; H01L23/473
Abstract:
A package which comprises at least one electronic chip, an encapsulant encapsulating at least part of the at least one electronic chip, and a shielding layer on at least part of an external surface of the encapsulant configured for shielding an interior of the package with regard to cooling fluid for removing thermal energy from the at least one electronic chip.
Public/Granted literature
- US11244886B2 Package cooled with cooling fluid and comprising shielding layer Public/Granted day:2022-02-08
Information query
IPC分类:
