公开(公告)号：US20180102302A1

公开(公告)日：2018-04-12

申请号：US15730758

申请日：2017-10-12

Applicant: Infineon Technologies AG

Inventor： Andreas GRASSMANN ,  Wolfram HABLE ,  Juergen HOEGERL ,  Angela KESSLER ,  Ivan NIKITIN ,  Achim STRASS

IPC: H01L23/373 ,  H01L23/492 ,  H01L23/66 ,  H01L23/00

CPC classification number: H01L23/3735 ,  H01L23/4334 ,  H01L23/4924 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45014 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/206

Abstract: A chip carrier which comprises a thermally conductive and electrically insulating sheet, a first electrically conductive structure on a first main surface of the sheet, and a second electrically conductive structure on a second main surface of the sheet, wherein the first electrically conductive structure and the second electrically conductive structure extend beyond a lateral edge of the sheet.

公开(公告)号：US20180082925A1

公开(公告)日：2018-03-22

申请号：US15710852

申请日：2017-09-21

Applicant: Infineon Technologies AG

Inventor： Andreas GRASSMANN ,  Wolfram HABLE ,  Juergen HOEGERL ,  Ivan NIKITIN ,  Achim STRASS

IPC: H01L23/42 ,  H01L23/473

CPC classification number: H01L23/42 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/473 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/552 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package which comprises at least one electronic chip, an encapsulant encapsulating at least part of the at least one electronic chip, and a shielding layer on at least part of an external surface of the encapsulant configured for shielding an interior of the package with regard to cooling fluid for removing thermal energy from the at least one electronic chip.