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公开(公告)号：US20180096919A1
公开(公告)日：2018-04-05
申请号：US15723431
申请日：2017-10-03
IPC分类号： H01L23/495 , H01L23/29 , H01L23/00 , H05K7/10 , H01L23/31 , H01L23/433 , H01L21/56
摘要： A chip carrier for carrying an electronic chip, wherein the chip carrier comprises a mounting section configured for mounting an electronic chip by sintering, and an encapsulation section configured for being encapsulated by an encapsulant.
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公开(公告)号：US20220238413A1
公开(公告)日：2022-07-28
申请号：US17155215
申请日：2021-01-22
发明人： Andreas GRASSMANN
IPC分类号： H01L23/373 , H01L23/495 , H01L23/367 , H01L23/00 , H01L25/07
摘要： A double sided cooling module that includes a leadframe with a top Direct Copper Bonded (DCB) substrate and two or more power transistor submodules. Each one of the power transistor submodules includes a bottom DCB substrate, a spaced-apart row of first wires attached to a top metal layer of the bottom DCB substrate proximate to the first side of the top metal layer, a semiconductor die having a bottom side load path contact attached to a top surface of a die pad portion of the top metal layer, a top side control contact electrically coupled via at least one bond wire to a top surface of a control pad portion of the top metal layer, and an electrically conductive and thermally conductive spacer that is attached to the top side load path contact and to a bottom metal layer of the top DCB substrate. At least one of the first wires is attached to the control pad portion of the top metal layer and to a bottom metal layer of the top DCB substrate. Other ones of the first wires are attached to the die pad portion of the top metal layer and to the bottom metal layer of the top DCB substrate.
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公开(公告)号：US20180040537A1
公开(公告)日：2018-02-08
申请号：US15665574
申请日：2017-08-01
IPC分类号： H01L23/473 , H01L21/56 , H01L23/433 , H01L21/48 , B60R16/02 , H01L23/31
摘要： A power module which comprises a semiconductor chip, at least one cooling plate with at least one cooling channel thermally coupled to the semiconductor chip and being configured so that a coolant is guidable through the at least one cooling channel, and an encapsulant encapsulating at least part of the semiconductor chip and part of the at least one cooling channel, wherein at least part of a main surface of the cooling plate forms part of an external surface of the power module.
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4.发明申请公开(公告)号：US20220230930A1
公开(公告)日：2022-07-21
申请号：US17575015
申请日：2022-01-13
发明人： Andreas GRASSMANN
摘要： A package is disclosed. In one example, the package comprises a carrier comprising a thermally conductive and electrically insulating layer, a laminate comprising a plurality of connected laminate layers, an electronic component mounted between the carrier and the laminate. An encapsulant is at least partially arranged between the carrier and the laminate and encapsulating at least part of the electronic component.
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公开(公告)号：US20180122720A1
公开(公告)日：2018-05-03
申请号：US15796771
申请日：2017-10-28
IPC分类号： H01L23/367 , H01L23/373 , H01L23/31 , H01L23/498 , H01L25/07 , H01L25/18 , H01L23/00 , H01L21/48 , H01L21/56 , H01L25/00
CPC分类号： H01L23/3675 , B60L11/18 , H01L21/4853 , H01L21/4882 , H01L21/565 , H01L23/3114 , H01L23/3121 , H01L23/3735 , H01L23/49811 , H01L23/49861 , H01L24/48 , H01L25/072 , H01L25/18 , H01L25/50 , H01L2224/33181 , H01L2224/48229 , H01L2224/4823 , H01L2224/48237 , H01L2224/73215 , H01L2224/73265 , H01L2924/10272 , H01L2924/1033 , H01L2924/1203 , H01L2924/13055 , H01L2924/14252 , H01L2924/30107 , H02M7/003
摘要： A package comprising at least one electronic chip, an encapsulant encapsulating at least part of the at least one electronic chip, a first electrically conductive contact structure extending partially within and partially outside of the encapsulant and being electrically coupled with at least one first terminal of at least one of the at least one electronic chip, and a second electrically conductive contact structure extending partially within and partially outside of the encapsulant and being electrically coupled with at least one second terminal of at least one of the at least one electronic chip, wherein at least a portion of the first electrically conductive contact structure and at least a portion of the second electrically conductive contact structure within the encapsulant are spaced in a direction between two opposing main surfaces of the package.
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6.发明申请公开(公告)号：US20180102302A1
公开(公告)日：2018-04-12
申请号：US15730758
申请日：2017-10-12
发明人： Andreas GRASSMANN , Wolfram HABLE , Juergen HOEGERL , Angela KESSLER , Ivan NIKITIN , Achim STRASS
IPC分类号： H01L23/373 , H01L23/492 , H01L23/66 , H01L23/00
CPC分类号： H01L23/3735 , H01L23/4334 , H01L23/4924 , H01L23/49562 , H01L23/49575 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45014 , H01L2924/00014 , H01L2924/1305 , H01L2924/13062 , H01L2924/13091 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2224/45099 , H01L2924/00012 , H01L2924/206
摘要： A chip carrier which comprises a thermally conductive and electrically insulating sheet, a first electrically conductive structure on a first main surface of the sheet, and a second electrically conductive structure on a second main surface of the sheet, wherein the first electrically conductive structure and the second electrically conductive structure extend beyond a lateral edge of the sheet.
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公开(公告)号：US20180082925A1
公开(公告)日：2018-03-22
申请号：US15710852
申请日：2017-09-21
IPC分类号： H01L23/42 , H01L23/473
CPC分类号： H01L23/42 , H01L23/3121 , H01L23/3735 , H01L23/473 , H01L23/49531 , H01L23/49575 , H01L23/552 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L2224/291 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1431 , H01L2924/1815 , H01L2924/3025 , H01L2924/00012 , H01L2924/014 , H01L2924/00014 , H01L2924/00
摘要： A package which comprises at least one electronic chip, an encapsulant encapsulating at least part of the at least one electronic chip, and a shielding layer on at least part of an external surface of the encapsulant configured for shielding an interior of the package with regard to cooling fluid for removing thermal energy from the at least one electronic chip.
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公开(公告)号：US20180082921A1
公开(公告)日：2018-03-22
申请号：US15709493
申请日：2017-09-20
发明人： Andreas GRASSMANN , Juergen HOEGERL , Kiyoung JANG , Ivan NIKITIN
IPC分类号： H01L23/367 , H01L23/31 , H01L23/373 , H01L23/495 , H01L21/56 , H01L21/48
摘要： A package comprising at least one electronic chip, a first heat removal body thermally coupled to a first main surface of the at least one electronic chip and configured for removing thermal energy from the at least one electronic chip, an encapsulant encapsulating at least part of the at least one electronic chip, and part of the first heat removal body, wherein at least part of a surface of the first heat removal body is roughened.
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公开(公告)号：US20150264796A1
公开(公告)日：2015-09-17
申请号：US14214962
申请日：2014-03-16
发明人： Christian NEUGIRG , Andreas GRASSMANN , Wolfram HABLE , Ottmar GEITNER , Frank WINTER , Alexander SCHWARZ , Inpil YOO
CPC分类号： H01L23/3733 , H01L21/4853 , H01L21/565 , H01L23/3114 , H01L23/373 , H01L23/49833 , H01L24/36 , H01L24/40 , H01L2224/40137 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/181 , Y10T29/4913 , Y10T29/49144 , H01L2924/00012 , H01L2224/37099
摘要： An electronic module is provided, which comprises a first carrier; an electronic chip comprising at least one electronic component and arranged on the first carrier; a spacing element comprising a surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component; a second carrier arranged on the spacing element; and a mold compound enclosing the electronic chip and the spacing element at least partially; wherein the spacing element comprises a material having a CTE value being matched with at least one other CTE.
摘要翻译： 提供一种电子模块，其包括第一载体; 电子芯片，其包括至少一个电子部件并且布置在所述第一载体上; 间隔元件，包括布置在所述电子芯片上并与所述至少一个电子部件导热连接的表面; 布置在间隔元件上的第二载体; 以及至少部分地包围所述电子芯片和所述间隔元件的模具化合物; 其中所述间隔元件包括具有与至少一个其它CTE匹配的CTE值的材料。
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