Invention Application
- Patent Title: HYBRID SUBSTRATE PROCESSING
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Application No.: US15712646Application Date: 2017-09-22
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Publication No.: US20180085857A1Publication Date: 2018-03-29
- Inventor: Nathan K. Gupta , Simon R. Lancaster-Larocque , Prithu Sharma , Weibo Cheng , Abhijit A. Kangude , Bryan W. Posner , Sudirukkuge T. Jinasundera , Karan Bir
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Main IPC: B23K26/36
- IPC: B23K26/36 ; B23K26/0622 ; B23K26/00 ; B23K26/08

Abstract:
A hybrid laser modulation and acid etch process for the creation of a patterned substrate. According to some embodiments, a hole is formed in a glass substrate by first modulating a portion of the substrate in the desired shape. A mask is coated on the glass substrate and is patterned to expose the modulated portion. The glass substrate is then acid etched to remove the modulated portion. Once the modulated portion has been etched, the desired shape may be removed from the glass substrate and the mask may be stripped.
Public/Granted literature
- US10300557B2 Hybrid substrate processing Public/Granted day:2019-05-28
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