Invention Application
- Patent Title: ELECTRICALLY CONDUCTIVE ADHESIVE AND ELECTRICALLY CONDUCTIVE MATERIAL
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Application No.: US15711284Application Date: 2017-09-21
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Publication No.: US20180086950A1Publication Date: 2018-03-29
- Inventor: Teppei KUNIMUNE , Masafumi KURAMOTO
- Applicant: Nichia Corporation
- Applicant Address: JP Anan-shi
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan-shi
- Priority: JP2016-186115 20160923
- Main IPC: C09J9/02
- IPC: C09J9/02 ; C09J171/02 ; C08K3/08

Abstract:
Disclosed is an electrically conductive adhesive containing: (A) a polyether polymer having a backbone comprising a repeating unit of the formula: —R1—O— wherein R1 is a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and (B) silver particles. Further disclosed is an electrically conductive material which is a hardened product of the electrically conductive adhesive.
Public/Granted literature
- US11162004B2 Electrically conductive adhesive and electrically conductive material Public/Granted day:2021-11-02
Information query
IPC分类: