公开(公告)号：US20230364676A1

公开(公告)日：2023-11-16

申请号：US18226642

申请日：2023-07-26

Applicant: Nichia Corporation

Inventor： Teppei KUNIMUNE ,  Masafumi KURAMOTO

IPC: B22F3/26 ,  B22F7/00 ,  B22F7/06 ,  B22F7/04 ,  B32B15/04 ,  B32B9/00 ,  B05D3/04

CPC classification number: B22F3/26 ,  B22F7/004 ,  B22F7/062 ,  B22F7/04 ,  B32B15/046 ,  B32B15/043 ,  B32B9/005 ,  B05D3/0493 ,  B05D2504/00 ,  B05D2601/22 ,  B22F2007/045 ,  B32B2307/422 ,  B05D2202/00

Abstract: A method of impregnating voids of a sintered metal body having a porous structure with resin, the method comprising preparing a resin material that contains a defoamer containing hydrophilic or hydrophobic particles, defoaming the prepared resin material by reducing pressure of the resin material, applying the defoamed resin material onto a surface of the sintered metal body, impregnating the voids with the resin material by reducing pressure of the sintered metal body and the resin material applied to the surface of the sintered metal body so as to expel gas from the voids; and curing the resin material by heating.

公开(公告)号：US20190091808A1

公开(公告)日：2019-03-28

申请号：US16136816

申请日：2018-09-20

Applicant: Nichia Corporation

Inventor： Teppei KUNIMUNE

IPC: B23K35/02 ,  B23K35/30 ,  H05K3/34 ,  H01L23/00

Abstract: The present disclosure provides a method for bonding an electronic component and a method for manufacturing a bonded body, which are capable of sintering a silver paste at a comparatively low temperature.Disclosed is a method for bonding an electronic component using a silver paste containing silver particles, the method including: applying a silver paste containing silver particles on a surface of a substrate and setting electronic components on the silver paste applied, heating in a reducing atmosphere at a temperature of lower than 300° C., and after heating in the reducing atmosphere, heating in an oxidizing atmosphere at a temperature of 300° C. or lower.

公开(公告)号：US20180086950A1

公开(公告)日：2018-03-29

申请号：US15711284

申请日：2017-09-21

Applicant: Nichia Corporation

Inventor： Teppei KUNIMUNE ,  Masafumi KURAMOTO

IPC: C09J9/02 ,  C09J171/02 ,  C08K3/08

CPC classification number: C09J9/02 ,  C08K3/08 ,  C08K2003/0806 ,  C09J171/02 ,  C09J2471/00 ,  C09J2483/00

Abstract: Disclosed is an electrically conductive adhesive containing: (A) a polyether polymer having a backbone comprising a repeating unit of the formula: —R1—O— wherein R1 is a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and (B) silver particles. Further disclosed is an electrically conductive material which is a hardened product of the electrically conductive adhesive.

公开(公告)号：US20170283624A1

公开(公告)日：2017-10-05

申请号：US15477868

申请日：2017-04-03

Applicant: NICHIA CORPORATION

Inventor： Teppei KUNIMUNE ,  Masafumi KURAMOTO

IPC: C09D5/24 ,  B22F1/00 ,  B22F9/30 ,  C09D7/12

CPC classification number: C09D5/24 ,  B22F1/0055 ,  B22F1/0074 ,  B22F9/30 ,  B22F2201/03 ,  B22F2201/50 ,  B22F2301/255 ,  B22F2998/10 ,  C09D7/68 ,  H01B1/22

Abstract: There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.

公开(公告)号：US20210323061A1

公开(公告)日：2021-10-21

申请号：US17229043

申请日：2021-04-13

Applicant: Nichia Corporation

Inventor： Teppei KUNIMUNE ,  Masafumi KURAMOTO

IPC: B22F3/26

Abstract: A method of impregnating voids of a sintered metal body having a porous structure with resin, the method comprising preparing a resin material that contains a defoamer containing hydrophilic or hydrophobic particles, defoaming the prepared resin material by reducing pressure of the resin material, applying the defoamed resin material onto a surface of the sintered metal body, impregnating the voids with the resin material by reducing pressure of the sintered metal body and the resin material applied to the surface of the sintered metal body so as to expel gas from the voids; and curing the resin material by heating.

公开(公告)号：US20210147695A1

公开(公告)日：2021-05-20

申请号：US17158295

申请日：2021-01-26

Applicant: NICHIA CORPORATION

Inventor： Teppei KUNIMUNE ,  Masafumi KURAMOTO

IPC: C09D5/24 ,  B22F1/00 ,  B22F9/30 ,  C09D7/40 ,  H01B1/22

Abstract: There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.

公开(公告)号：US20220017793A1

公开(公告)日：2022-01-20

申请号：US17488687

申请日：2021-09-29

Applicant: Nichia Corporation

Inventor： Teppei KUNIMUNE ,  Masafumi KURAMOTO

IPC: C09J9/02 ,  C08K3/08 ,  C09J171/02

Abstract: Disclosed is an electrically conductive adhesive containing:
(A) a polyether polymer having a backbone comprising a repeating unit of the formula: —R1—O— wherein R1 is a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and (B) silver particles. Further disclosed is an electrically conductive material which is a hardened product of the electrically conductive adhesive.

公开(公告)号：US20180315913A1

公开(公告)日：2018-11-01

申请号：US15964568

申请日：2018-04-27

Applicant: NICHIA CORPORATION

Inventor： Teppei KUNIMUNE ,  Masafumi KURAMOTO

IPC: H01L33/62 ,  H01B1/22 ,  H01B1/16

Abstract: Provided is a metal powder sintering paste having a high resistance to thermal stress. The present invention provides a metal powder sintering paste containing silver particles having an average particle diameter (median diameter) of 0.3 μm to 5 μm as a main component, further containing inorganic spacer particles having a CV value (standard deviation/average value) of less than 5%, and containing substantially no resin.

公开(公告)号：US20230215596A1

公开(公告)日：2023-07-06

申请号：US18120540

申请日：2023-03-13

Applicant: NICHIA CORPORATION

Inventor： Teppei KUNIMUNE ,  Masafumi KURAMOTO

IPC: H01B1/22 ,  B22F1/107 ,  B22F1/068 ,  C09D5/24 ,  B22F9/30 ,  C09D7/40

CPC classification number: H01B1/22 ,  B22F1/107 ,  B22F1/068 ,  C09D5/24 ,  B22F9/30 ,  C09D7/68 ,  B22F2201/03 ,  B22F2201/50 ,  B22F2998/10 ,  B22F2301/255

Abstract: There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.

公开(公告)号：US20230041361A1

公开(公告)日：2023-02-09

申请号：US17869709

申请日：2022-07-20

Applicant: NICHIA CORPORATION

Inventor： Teppei KUNIMUNE ,  Yasuaki KAWATA

IPC: G02B5/28 ,  G02B1/14 ,  C09K11/77

Abstract: A wavelength conversion module includes a base, a wavelength conversion member consisting of a phosphor, and a bonding member including a metal part that bonds the base and the wavelength conversion member. A thickness of the wavelength conversion member is less than 100 μm.