Invention Application
- Patent Title: SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND STORAGE MEDIUM
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Application No.: US15718369Application Date: 2017-09-28
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Publication No.: US20180096863A1Publication Date: 2018-04-05
- Inventor: Gentaro GOSHI , Hiromi KIYOSE , Yasuo KIYOHARA
- Applicant: Tokyo Electron Limited
- Priority: JP2016-196630 20161004
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B3/08 ; F26B5/00

Abstract:
Disclosed is a substrate liquid processing method including: a first processing step of discharging a fluid in the processing container until an inside of the processing container reaches a first discharge ultimate pressure at which the processing fluid in the supercritical state is not vaporized, and then supplying the processing fluid into the processing container until the inside of the processing container reaches a first supply ultimate pressure at which vaporization of the processing fluid does not occur; and a second processing step of discharging a fluid in the processing container until the inside of the processing container reaches a second discharge ultimate pressure at which the processing fluid in the supercritical state is not vaporized, and then supplying the processing fluid into the processing container until the inside of the processing container reaches a second supply ultimate pressure at which vaporization of the processing fluid does not occur.
Information query
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