Invention Application
- Patent Title: NON-PLANAR ON-PACKAGE VIA CAPACITOR
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Application No.: US15283352Application Date: 2016-10-01
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Publication No.: US20180098428A1Publication Date: 2018-04-05
- Inventor: Fay HUA , Brandon M. RAWLINGS , Georgios C. DOGIAMIS , Telesphor KAMGAING
- Applicant: Intel Corporation
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H01L23/498 ; H01L21/48 ; H05K3/42 ; H05K3/00 ; H01L25/16 ; H05K1/11
Abstract:
Embodiments are generally directed to non-planar on-package via capacitor. An embodiment of an embedded capacitor includes a first plate that is formed in a package via; a dielectric layer that is applied on the first plate; and a second plate that is formed in a cavity in the dielectric layer, wherein the first plate and the second plate are non-planar plates.
Public/Granted literature
- US10595410B2 Non-planar on-package via capacitor Public/Granted day:2020-03-17
Information query
