-
公开(公告)号：US20180233431A1
公开(公告)日：2018-08-16
申请号：US15745701
申请日：2015-09-25
Applicant: Intel Corporation
Inventor： Adel A. ELSHERBINI , Henning BRAUNISCH , Brandon M. RAWLINGS , Aleksandar ALEKSOV , Feras EID , Javier SOTO
IPC: H01L23/48 , H01L21/48 , H01L21/768 , H01L23/522 , H01L23/532
CPC classification number: H01L23/481 , H01L21/486 , H01L21/76897 , H01L21/76898 , H01L23/48 , H01L23/5226 , H01L23/53209 , H01L23/53295
Abstract: Embodiments of the invention include conductive vias and methods for forming the conductive vias. In one embodiment, a via pad is formed over a first dielectric layer and a photoresist layer is formed over the first dielectric layer and the via pad. Embodiments may then include patterning the photoresist layer to form a via opening over the via pad and depositing a conductive material into the via opening to form a via over the via pad. Embodiments may then includeremoving the photoresist layer and forming a second dielectric layer over the first dielectric layer, the via pad, and the via. For example a top surface of the second dielectric layer is formed above a top surface of the via in some embodiments. Embodiments may then include recessing the second dielectric layer to expose a top portion of the via.
-
公开(公告)号：US20190006298A1
公开(公告)日：2019-01-03
申请号：US16127820
申请日：2018-09-11
Applicant: Intel Corporation
Inventor： Georgios C. DOGIAMIS , Sasha N. OSTER , Telesphor KAMGAING , Adel A. ELSHERBINI , Brandon M. RAWLINGS , Feras EID
IPC: H01L23/66 , H01L23/367 , H01L23/498 , H01L23/538 , H01L25/065 , H01L23/00
CPC classification number: H01L23/66 , H01L23/367 , H01L23/3675 , H01L23/49827 , H01L23/49838 , H01L23/5383 , H01L24/13 , H01L24/16 , H01L24/73 , H01L25/0655 , H01L2223/6627 , H01L2223/6677 , H01L2224/12105 , H01L2224/131 , H01L2224/16227 , H01L2224/73253 , H01L2924/014 , H01L2924/1421 , H01L2924/1432 , H01L2924/1434 , H01L2924/15192 , H01L2924/15311 , H01L2924/15313 , H01L2924/15321 , H01L2924/16251 , H01L2924/163 , H01L2924/00014
Abstract: Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.
-
公开(公告)号：US20180315690A1
公开(公告)日：2018-11-01
申请号：US15773030
申请日：2015-12-21
Applicant: Intel Corporation
Inventor： Adel A. ELSHERBINI , Mathew J. MANUSHAROW , Krishna BHARATH , William J. LAMBERT , Robert L. SANKMAN , Aleksandar ALEKSOV , Brandon M. RAWLINGS , Feras EID , Javier SOTO GONZALEZ , Meizi JIAO , Suddhasattwa NAD , Telesphor KAMGAING
CPC classification number: H01F27/40 , H01F17/0006 , H01L28/00
Abstract: Embodiments of the invention include an electrical package and methods of forming the package. In one embodiment, a transformer may be formed in the electrical package. The transformer may include a first conductive loop that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first conductive loop from a second conductive loop that is formed in the package. Additional embodiments of the invention include forming a capacitor formed in the electrical package. For example, the capacitor may include a first capacitor plate that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first capacitor plate form a second capacitor plate that is formed in the package. The thin dielectric spacer material in the transformer and capacitor allow for increased coupling factors and capacitance density in electrical components.
-
公开(公告)号：US20190150291A1
公开(公告)日：2019-05-16
申请号：US16230977
申请日：2018-12-21
Applicant: Intel Corporation
Inventor： Brandon M. RAWLINGS , Henning BRAUNISCH
Abstract: A photoresist is deposited on a seed layer on a substrate. A first region of the photoresist is removed to expose a first portion of the seed layer to form a via-pad structure. A first conductive layer is deposited onto the first portion of the seed layer. A second region of the photoresist adjacent to the first region is removed to expose a second portion of the seed layer to form a line. A second conductive layer is deposited onto the first conductive layer and the second portion of the seed layer.
-
5.发明申请公开(公告)号：US20180234128A1
公开(公告)日：2018-08-16
申请号：US15745980
申请日：2015-09-25
Applicant: Intel Corporation
Inventor： Adel A. ELSHERBINI , Telesphor KAMGAING , Sasha N. OSTER , Brandon M. RAWLINGS , Georgios C. DOGIAMIS
Abstract: Communication is described between integrated circuit packages using a millimeter-wave wireless radio fabric. In one example a first package has a radio transceiver to communicate with a radio transceiver of a second package. The second package has a radio transceiver to communicate with the radio transceiver of the first package. A switch communicates with the first package and the second package to establish a connection through the respective radio transceivers between the first package and the second package. A system board carries the first package, the second package, and the switch.
-
Patent Agency Ranking
6.发明申请公开(公告)号：US20180217949A1
公开(公告)日：2018-08-02
申请号：US15746318
申请日：2015-09-25
Applicant: Intel Corporation
Inventor： Sasha N. OSTER , Telesphor KAMGAING , Adel A. ELSHERBINI , Georgios C. DOGIAMIS , Brandon M. RAWLINGS
Abstract: Microelectronic package communications are described that use radio interfaces that are connected through waveguides. One example includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, and a radio on the package substrate coupled to the radio chip to modulate the data over a carrier and to transmit the modulated data. A waveguide connector is coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide carries the modulated data to an external component.
-
公开(公告)号：US20220102261A1
公开(公告)日：2022-03-31
申请号：US17544693
申请日：2021-12-07
Applicant: Intel Corporation
Inventor： Adel A. ELSHERBINI , Mathew J. MANUSHAROW , Krishna BHARATH , William J. LAMBERT , Robert L. SANKMAN , Aleksandar ALEKSOV , Brandon M. RAWLINGS , Feras EID , Javier SOTO GONZALEZ , Meizi JIAO , Suddhasattwa NAD , Telesphor KAMGAING
IPC: H01L23/498 , H01F17/00 , H01F27/40 , H01L49/02 , H01F27/28 , H01F41/04 , H01G4/33 , H01L21/48 , H01L23/66
Abstract: Embodiments of the invention include an electrical package and methods of forming the package. In one embodiment, a transformer may be formed in the electrical package. The transformer may include a first conductive loop that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first conductive loop from a second conductive loop that is formed in the package. Additional embodiments of the invention include forming a capacitor formed in the electrical package. For example, the capacitor may include a first capacitor plate that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first capacitor plate form a second capacitor plate that is formed in the package. The thin dielectric spacer material in the transformer and capacitor allow for increased coupling factors and capacitance density in electrical components.
-
8.发明申请公开(公告)号：US20190393118A1
公开(公告)日：2019-12-26
申请号：US16016399
申请日：2018-06-22
Applicant: Intel Corporation
Inventor： Brandon M. RAWLINGS , Feras EID , Kelly LOFGREEN
IPC: H01L23/367 , H01L23/42 , H01L23/00 , H01L21/52 , H01L25/065
Abstract: A package is disclosed. The package includes a substrate, a die on the substrate, an integrated heat spreader on the substrate that encloses the die, the integrated heat spreader including a hole that extends through the integrated heat spreader, an air permeable adhesive contacting the integrated heat spreader and forming a cavity underneath the integrated heat spreader, and a liquid metal thermal interface material filling the cavity. A sealant plugs the hole that extends through the integrated heat spreader.
-
公开(公告)号：US20180212306A1
公开(公告)日：2018-07-26
申请号：US15746364
申请日：2015-09-25
Applicant: Intel Corporation
Inventor： Adel A. ELSHERBINI , Telesphor KAMGAING , Sasha N. OSTER , Brandon M. RAWLINGS , Georgios C. DOGIAMIS
CPC classification number: H01Q1/2283 , H01L2223/6677 , H01Q9/0457 , H01Q13/02
Abstract: Antennas are described for platform level wireless interconnects. In one example, a substantially flat package substrate has an attached radio. A conductive transmission line on the package substrate is electrically connected to the radio and an antenna is attached to the package substrate connected to the conductive transmission line, the antenna radiating to the side of the package.
-
公开(公告)号：US20180098428A1
公开(公告)日：2018-04-05
申请号：US15283352
申请日：2016-10-01
Applicant: Intel Corporation
Inventor： Fay HUA , Brandon M. RAWLINGS , Georgios C. DOGIAMIS , Telesphor KAMGAING
Abstract: Embodiments are generally directed to non-planar on-package via capacitor. An embodiment of an embedded capacitor includes a first plate that is formed in a package via; a dielectric layer that is applied on the first plate; and a second plate that is formed in a cavity in the dielectric layer, wherein the first plate and the second plate are non-planar plates.
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.027 seconds)
