Invention Application
- Patent Title: ENCAPSULATING FILM STACKS FOR OLED APPLICATIONS
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Application No.: US15843295Application Date: 2017-12-15
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Publication No.: US20180114946A1Publication Date: 2018-04-26
- Inventor: Jrjyan Jerry CHEN , Xiangxin RUI , Soo Young CHOI
- Applicant: Applied Materials, Inc.
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L21/67 ; H01L21/687 ; H01L21/677

Abstract:
Embodiments described herein generally relate to a method and apparatus for encapsulating an OLED structure, more particularly, to a TFE structure for an OLED structure. The TFE structure includes at least one dielectric layer and at least two barrier layers, and the TFE structure is formed over the OLED structure. The at least one dielectric layer is deposited by atomic layer deposition (ALD). Having the at least one dielectric layer formed by ALD in the TFE structure improves the barrier performance of the TFE structure.
Public/Granted literature
- US10158098B2 Encapsulating film stacks for OLED applications Public/Granted day:2018-12-18
Information query
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