- 专利标题: LEAK CHECKING METHOD, LEAK CHECKING APPARATUS, ELECTROPLATING METHOD, AND ELECTROPLATING APPARATUS
-
申请号: US15808466申请日: 2017-11-09
-
公开(公告)号: US20180135198A1公开(公告)日: 2018-05-17
- 发明人: Shoichiro OGATA , Masaaki KIMURA , Mitsutoshi YAHAGI
- 申请人: EBARA CORPORATION
- 优先权: JP2016-221906 20161114
- 主分类号: C25D17/06
- IPC分类号: C25D17/06 ; C25D7/12 ; G01M3/32 ; H01L21/687 ; H01L21/288
摘要:
There is disclosed an improved leak checking method which can accurately test a sealing performance of a substrate holder more than conventional leak check techniques. The leak checking method includes: holding a substrate with a substrate holder, the substrate holder including a first holding member and a second holding member, the second holding member having an opening through which a surface of the substrate is exposed; pressing a sealing projection of the second holding member against the surface of the substrate when holding the substrate with the substrate holder; covering the surface of the substrate, exposed through the opening, and the sealing projection with a sealing cap; forming a hermetic space between the sealing cap and the substrate holder; introducing a pressurized gas into the hermetic space; and detecting a decrease in pressure of the pressurized gas in the hermetic space.
公开/授权文献
信息查询