Invention Application
- Patent Title: METHOD AND APPARATUS FOR ATTACHING CHIP TO A TEXTILE
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Application No.: US15702336Application Date: 2017-09-12
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Publication No.: US20180187347A1Publication Date: 2018-07-05
- Inventor: David Graumann , David Bruneau
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: D03J1/00
- IPC: D03J1/00 ; H05K1/03 ; D03D1/00 ; D03D15/00 ; D03D15/02 ; H05K1/18
Abstract:
Embodiments disclosed herein provide approaches for attaching scan control and other electronic chips to textiles, e.g., on a loom as part of a real-time manufacturing process.
Information query
IPC分类:
| D | 纺织；造纸 |
| D03 | 织造 |
| D03J | 织造的辅助设备；织布工工具；梭子 |
| D03J1/00 | 与织机相结合或相关的辅助设备 |
