公开(公告)号：US20180187347A1

公开(公告)日：2018-07-05

申请号：US15702336

申请日：2017-09-12

Applicant: Intel Corporation

Inventor： David Graumann ,  David Bruneau

IPC: D03J1/00 ,  H05K1/03 ,  D03D1/00 ,  D03D15/00 ,  D03D15/02 ,  H05K1/18

CPC classification number: D03J1/00 ,  D03D1/0088 ,  D03D15/00 ,  D03D15/02 ,  D10B2101/20 ,  D10B2201/02 ,  D10B2211/02 ,  D10B2401/16 ,  D10B2503/04 ,  D10B2505/08 ,  H05K1/038 ,  H05K1/189 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10977 ,  Y10T29/49117 ,  Y10T29/5313

Abstract: Embodiments disclosed herein provide approaches for attaching scan control and other electronic chips to textiles, e.g., on a loom as part of a real-time manufacturing process.

公开(公告)号：US20210087721A1

公开(公告)日：2021-03-25

申请号：US17013097

申请日：2020-09-04

Applicant: Intel Corporation

Inventor： David Graumann ,  David Bruneau

IPC: D03J1/00 ,  D03D1/00 ,  D03D15/00 ,  D03D15/02 ,  H05K1/03

Abstract: Embodiments disclosed herein provide approaches for attaching scan control and other electronic chips to textiles, e.g., on a loom as part of a real-time manufacturing process.