A substrate cleaning apparatus for performing scrub cleaning of a surface of a substrate by rotating both of the substrate and a roll cleaning member while keeping the roll cleaning member in contact with the surface. The apparatus includes a roll holder configured to support and rotate a roll cleaning member, a vertical movement mechanism, having a vertically movable unit vertically movable by actuating an actuator having a regulating device, configured to vertically move the roll holder coupled to the vertically movable unit so the roll cleaning member applies a roll load to the substrate W while cleaning the substrate. A load cell provided between the vertically movable unit of the vertical movement mechanism and the roll holder is configured to measure the roll load. A controller is configured to perform feedback control of the roll load through the regulating device based on a measured value of the load cell.