Invention Application
- Patent Title: SHIELDED INTERCONNECT ARRAY
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Application No.: US15476582Application Date: 2017-03-31
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Publication No.: US20180287305A1Publication Date: 2018-10-04
- Inventor: Youngseok Oh , Justin M. Huttula , Mohanraj Probhugoud , Ronald Kirby , Joe Walczyk , Erkan Acar
- Applicant: Intel Corporation
- Main IPC: H01R13/6594
- IPC: H01R13/6594 ; H01R13/11 ; H01R13/6585 ; H01R13/66 ; H01R43/26

Abstract:
A shielded interconnect array and associated methods are described. Examples of the shielded interconnect array include socket connections that include conductive members with flexible bends. In examples shown, corresponding grounded conductive members with flexible bends are located adjacent to other conductive members with flexible bends to provide shielding.
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