公开(公告)号：US11656247B2

公开(公告)日：2023-05-23

申请号：US16473378

申请日：2017-03-31

Applicant: Intel Corporation

Inventor： Ronald Michael Kirby ,  Erkan Acar ,  Joe Walczyk ,  Youngseok Oh ,  Justin M Huttula ,  Mohanraj Prabhugoud

IPC: G01R1/07 ,  G01R1/04 ,  G01R1/073

CPC classification number: G01R1/07357 ,  G01R1/0466

Abstract: A coaxial wire interconnect architecture and associated methods are described. In one example, the coaxial wire interconnect architecture is used in a test socket interconnect array. Flexible bends are formed in one or more of the coaxial wire interconnects to provide compliant connections to an electronic device during testing.

公开(公告)号：US20180287305A1

公开(公告)日：2018-10-04

申请号：US15476582

申请日：2017-03-31

Applicant: Intel Corporation

Inventor： Youngseok Oh ,  Justin M. Huttula ,  Mohanraj Probhugoud ,  Ronald Kirby ,  Joe Walczyk ,  Erkan Acar

IPC: H01R13/6594 ,  H01R13/11 ,  H01R13/6585 ,  H01R13/66 ,  H01R43/26

Abstract: A shielded interconnect array and associated methods are described. Examples of the shielded interconnect array include socket connections that include conductive members with flexible bends. In examples shown, corresponding grounded conductive members with flexible bends are located adjacent to other conductive members with flexible bends to provide shielding.

公开(公告)号：US10469181B2

公开(公告)日：2019-11-05

申请号：US15993890

申请日：2018-05-31

Applicant: Intel Corporation

Inventor： Jin Pan ,  Erkan Acar ,  Stephen S. Sturges

IPC: H04B17/00 ,  H04B17/15 ,  H04B17/29

Abstract: A test apparatus and method of testing a DUT are described. The apparatus includes a receiver and transmitter path each having a pair of switches that switch between a bypass position and a direct position. The bypass position is used for low frequency signals communicated through the apparatus. The direct position allows higher frequency signals to be double converted by upconversion to an IF signal and bandpass filtered before being downconverted to a predetermined frequency. Both variable and fixed LO signals are used to convert the double converted signals so that the same IF may be used independent of the higher frequency signal received or transmitted. Bandpass filtering is applied before and after amplification of the IF signal. Lowpass filtering before and after the double conversion use LPFs of different cutoff frequencies.

公开(公告)号：US10101367B2

公开(公告)日：2018-10-16

申请号：US14683742

申请日：2015-04-10

Applicant: INTEL CORPORATION

Inventor： Jin Pan ,  Jin Yang ,  Erkan Acar

IPC: G01R3/00 ,  G01R1/073 ,  G01R31/28

Abstract: A microelectronic test device comprising an organic substrate, a probe holder, and an interposer disposed between the organic substrate and the probe holder, wherein the interposer has a coefficient of thermal expansion that is less than a coefficient of thermal expansion of the organic substrate. The interposer may effectively decouple the organic substrate from probes in the probe holder, which may substantially reduce or eliminate probe misalignment due to the coefficient of thermal expansion mismatch between the organic substrate and other components of the microelectronic test device and to provide require stiffness to the organic substrate.

公开(公告)号：US20180188288A1

公开(公告)日：2018-07-05

申请号：US15393640

申请日：2016-12-29

Applicant: Intel Corporation

Inventor： Erkan Acar ,  Abram M. Detofsky ,  Jin Pan

IPC: G01R1/04 ,  G01R31/28

Abstract: In one embodiment, a device to test one or more electronic components comprises a first card comprising a first test device communicatively coupled to at least a first connector assembly positioned on the first card and a second card comprising a second test device communicatively coupled to at least a second connector assembly positioned on the second card. The at least a first connector assembly is directly communicatively coupled to the at least a second connector assembly to provide a direct communication interface between the first test device and the second test device that is not routed via a backplane. Other embodiments may be described.

公开(公告)号：US20160299174A1

公开(公告)日：2016-10-13

申请号：US14683742

申请日：2015-04-10

Applicant: INTEL CORPORATION

Inventor： Jin Pan ,  Jin Yang ,  Erkan Acar

IPC: G01R1/073 ,  G01R3/00 ,  G01R1/04

CPC classification number: G01R3/00 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2889

Abstract: A microelectronic test device comprising an organic substrate, a probe holder, and an interposer disposed between the organic substrate and the probe holder, wherein the interposer has a coefficient of thermal expansion that is less than a coefficient of thermal expansion of the organic substrate. The interposer may effectively decouple the organic substrate from probes in the probe holder, which may substantially reduce or eliminate probe misalignment due to the coefficient of thermal expansion mismatch between the organic substrate and other components of the microelectronic test device and to provide require stiffness to the organic substrate.

Abstract translation: 一种微电子测试装置，包括有机衬底，探针保持器和设置在有机衬底和探针支架之间的插入器，其中插入器的热膨胀系数小于有机衬底的热膨胀系数。 插入器可以有效地将有机衬底与探针保持器中的探针分离，这可以由于有机衬底和微电子测试装置的其它部件之间的热膨胀失配系数而大大减少或消除探针不对准，并且为 有机底物。