公开(公告)号：US11930620B2

公开(公告)日：2024-03-12

申请号：US16914294

申请日：2020-06-27

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Cora Nien ,  Gavin Sung ,  Tim Liu ,  Lance Lin ,  Wan Yu Liu ,  Gerry Juan ,  Jason Y. Jiang ,  Justin M. Huttula ,  Evan Piotr Kuklinski ,  Juha Tapani Paavola ,  Arnab Sen ,  Hari Shanker Thakur ,  Prakash Kurma Raju

IPC: G06F1/20 ,  H01L23/427 ,  H05K7/20

CPC classification number: H05K7/20309 ,  G06F1/203 ,  H01L23/427 ,  H05K7/20136 ,  H05K7/20336

Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.

公开(公告)号：USD1054410S1

公开(公告)日：2024-12-17

申请号：US29733192

申请日：2020-04-30

Applicant: Intel Corporation

Designer： Aleksander Magi ,  Melissa Gregg ,  Todd Smith ,  James Okuley ,  Praveen Vishakantaiah ,  Prosenjit Ghosh ,  Fredrik Hamberger ,  Juha Paavola ,  Justin M. Huttula

公开(公告)号：US11963335B2

公开(公告)日：2024-04-16

申请号：US16914053

申请日：2020-06-26

Applicant: Intel Corporation

Inventor： Juha Tapani Paavola ,  Jerrod Peterson ,  Justin M. Huttula ,  Ellann Cohen ,  Ruander Cardenas

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K7/2039 ,  H05K1/0203 ,  H05K7/20336 ,  H05K2201/2036

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a sandwich plate construction heatsink. The sandwich plate construction heatsink can include a cold plate, one or more heat pipes over the cold plate, and a top plate over the one or more heat pipes. The cold plate can include a channel to accommodate the one or more heat pipes and/or the top plate can include a channel to accommodate the one or more heat pipes. The cold plate can be over a heat source in the electronic device.

公开(公告)号：US20230022182A1

公开(公告)日：2023-01-26

申请号：US17710822

申请日：2022-03-31

Applicant: The Intel Corporation

Inventor： Juha Paavola ,  Justin M. Huttula ,  Jerrod Peterson ,  Shawn McEuen ,  Kerry A. Stevens

IPC: G06F1/20 ,  H05K7/20

Abstract: Thermal management systems having pre-stressed biasing elements and related methods are disclosed. An example electronic component includes a circuit board, a processor coupled to the circuit board, and a thermally conductive structure positioned adjacent the processor. The thermally conductive structure is to dissipate heat generated by the processor. The electronic component includes a pre-stressed biasing element coupled to the thermally conductive structure and positioned between the processor and the thermally conductive structure. The pre-stressed biasing element is pre-stressed prior to attachment to the thermally conductive structure and the circuit board.

公开(公告)号：US20200337178A1

公开(公告)日：2020-10-22

申请号：US16914053

申请日：2020-06-26

Applicant: Intel Corporation

Inventor： Juha Tapani Paavola ,  Jerrod Peterson ,  Justin M. Huttula ,  Ellann Cohen ,  Ruander Cardenas

IPC: H05K7/20 ,  H05K1/02

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a sandwich plate construction heatsink. The sandwich plate construction heatsink can include a cold plate, one or more heat pipes over the cold plate, and a top plate over the one or more heat pipes. The cold plate can include a channel to accommodate the one or more heat pipes and/or the top plate can include a channel to accommodate the one or more heat pipes. The cold plate can be over a heat source in the electronic device.

公开(公告)号：US20180287305A1

公开(公告)日：2018-10-04

申请号：US15476582

申请日：2017-03-31

Applicant: Intel Corporation

Inventor： Youngseok Oh ,  Justin M. Huttula ,  Mohanraj Probhugoud ,  Ronald Kirby ,  Joe Walczyk ,  Erkan Acar

IPC: H01R13/6594 ,  H01R13/11 ,  H01R13/6585 ,  H01R13/66 ,  H01R43/26

Abstract: A shielded interconnect array and associated methods are described. Examples of the shielded interconnect array include socket connections that include conductive members with flexible bends. In examples shown, corresponding grounded conductive members with flexible bends are located adjacent to other conductive members with flexible bends to provide shielding.

公开(公告)号：US09922619B2

公开(公告)日：2018-03-20

申请号：US14670095

申请日：2015-03-26

Applicant: Intel Corporation

Inventor： Anand S. Konanur ,  Ulun Karacaoglu ,  Justin M. Huttula ,  Farid Adrangi

IPC: G09G5/00 ,  G06F3/14

CPC classification number: G09G5/006 ,  G06F3/1423 ,  G09G2330/021 ,  G09G2330/023 ,  G09G2370/16 ,  G09G2380/14

Abstract: Disclosed herein is a computing device configured to send display data to a display through a near-field communication (NFC) interface. The computing device includes a chassis, a primary display, and a near-field communication interface to transmit display data to a secondary display.

公开(公告)号：US20160180805A1

公开(公告)日：2016-06-23

申请号：US14670095

申请日：2015-03-26

Applicant: Intel Corporation

Inventor： Anand S. Konanur ,  Ulun Karacaoglu ,  Justin M. Huttula ,  Farid Adrangi

IPC: G09G5/00 ,  G06F3/14

CPC classification number: G09G5/006 ,  G06F3/1423 ,  G09G2330/021 ,  G09G2330/023 ,  G09G2370/16 ,  G09G2380/14

Abstract: Disclosed herein is a computing device configured to send display data to a display through a near-field communication (NFC) interface. The computing device includes a chassis, a primary display, and a near-field communication interface to transmit display data to a secondary display.

Abstract translation: 这里公开了一种被配置为通过近场通信（NFC）接口将显示数据发送到显示器的计算设备。 计算设备包括底盘，主显示器和用于将显示数据发送到辅助显示器的近场通信接口。