Invention Application
- Patent Title: GRAPHICS PROCESSING INTEGRATED CIRCUIT PACKAGE
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Application No.: US15482796Application Date: 2017-04-09
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Publication No.: US20180293205A1Publication Date: 2018-10-11
- Inventor: Altug Koker , Farshad Akhbari , Feng Chen , Dukhwan Kim , Narayan Srinivasa , Nadathur Rajagopalan Satish , Liwei Ma , Jeremy Bottleson , Eriko Nurvitadhi , Joydeep Ray , Ping T. Tang , Michael Strickland , Xiaoming Chen , Tatiana Shpeisman , Abhishek R. Appu
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: G06F15/80
- IPC: G06F15/80 ; G06F9/30 ; G06F9/38 ; G06F13/40 ; G11C5/02
Abstract:
An integrated circuit (IC) package apparatus is disclosed. The IC package includes one or more processing units and a bridge, mounted below the one or more processing unit, including one or more arithmetic logic units (ALUs) to perform atomic operations.
Public/Granted literature
- US10540318B2 Graphics processing integrated circuit package Public/Granted day:2020-01-21
Information query
