Invention Application
- Patent Title: ARTICLES AND METHODS FOR CONTROLLED BONDING OF THIN SHEETS WITH CARRIERS
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Application No.: US15921034Application Date: 2018-03-14
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Publication No.: US20180297324A1Publication Date: 2018-10-18
- Inventor: Kaveh Adib , Robert Alan Bellman , Dana Craig Bookbinder , Theresa Chang , Shiwen Liu , Robert George Manley , Prantik Mazumder
- Applicant: Corning Incorporated
- Main IPC: B32B7/06
- IPC: B32B7/06 ; B32B17/06 ; C03C27/10 ; C03C27/06 ; C03C23/00 ; C03C17/22 ; B32B7/02 ; B32B37/26

Abstract:
A method of controllably bonding a thin sheet having a thin sheet bonding surface with a carrier having a carrier bonding surface, by depositing a carbonaceous surface modification layer onto at least one of the thin sheet bonding surface and the carrier bonding surface, incorporating polar groups with the surface modification layer, and then bonding the thin sheet bonding surface to the carrier bonding surface via the surface modification layer. The surface modification layer may include a bulk carbonaceous layer having a first polar group concentration and a surface layer having a second polar group concentration, wherein the second polar group concentration is higher than the first polar group concentration. The surface modification layer deposition and the treatment thereof may be performed by plasma polymerization techniques.
Public/Granted literature
- US11123954B2 Articles and methods for controlled bonding of thin sheets with carriers Public/Granted day:2021-09-21
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