公开(公告)号：US12019209B2

公开(公告)日：2024-06-25

申请号：US17173833

申请日：2021-02-11

Applicant: Corning Incorporated

Inventor： Robert Alan Bellman ,  Joan Deanna Gregorski ,  Shandon Dee Hart ,  Karl William Koch, III ,  Carlo Anthony Kosik Williams ,  Charles Andrew Paulson ,  James Joseph Price

IPC: G02B1/14 ,  B24C1/06 ,  C03C15/00 ,  C03C17/34 ,  G02B1/11 ,  G02B5/02

CPC classification number: G02B1/14 ,  C03C15/00 ,  C03C17/3435 ,  C03C17/3452 ,  G02B5/0236 ,  G02B5/0294 ,  B24C1/06 ,  C03C2204/08 ,  C03C2217/734 ,  C03C2217/78 ,  G02B1/11

Abstract: According to one or more embodiments described herein, a coated article may comprise: a transparent substrate having a major surface, the major surface comprising a textured or rough surface inducing light scattering; and an optical coating disposed on the major surface of the transparent substrate and forming an air-side surface, the optical coating comprising one or more layers of material, the optical coating having a physical thickness of greater than 300 nm, wherein the coated article exhibits a maximum hardness of about 10 GPa or greater as measured on the air-side surface by a Berkovich Indenter Hardness Test along an indentation depth of about 50 nm or greater.

公开(公告)号：US11953462B2

公开(公告)日：2024-04-09

申请号：US18122192

申请日：2023-03-16

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Jeffrey Stapleton King ,  Scott Christopher Pollard

IPC: G01N27/404 ,  C03B33/02 ,  C03C15/00 ,  C03C17/06 ,  C03C23/00 ,  C03C27/10 ,  G01N27/406 ,  G01N27/413

CPC classification number: G01N27/404 ,  C03B33/0222 ,  C03C15/00 ,  C03C17/06 ,  C03C23/0025 ,  C03C27/10 ,  G01N27/4062 ,  G01N27/413 ,  C03C2217/254

Abstract: A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.

公开(公告)号：US11577992B2

公开(公告)日：2023-02-14

申请号：US16754655

申请日：2018-10-12

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  David Francis Dawson-Elli ,  Shiwen Liu ,  Chuanche Wang

IPC: C03C17/02

Abstract: A method includes depositing a surface modification layer on sidewalls of a plurality of cavities of a shaped article. The surface modification layer is formed from a glass material including a mobile component. The shaped article is formed from a glass material, a glass ceramic material, or a combination thereof. At least a portion of the mobile component is migrated from the surface modification layer into surface regions of the sidewalls of the shaped article, whereby subsequent to the migration, the surface regions have a reduced annealing point compared to a bulk of the shaped article. The surface modification layer and the surface regions of the sidewalls are reflowed. A surface roughness of the surface modification layer disposed on the sidewalls following the reflowing is less than a surface roughness of the sidewalls prior to the depositing.

公开(公告)号：US11167532B2

公开(公告)日：2021-11-09

申请号：US15574560

申请日：2016-05-17

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Robert Alan Bellman

IPC: B32B17/10 ,  B32B7/06 ,  C03C17/30 ,  C03C27/10 ,  B32B17/06 ,  B32B37/10

Abstract: Described herein are organosilicon modification layers and associated deposition methods and inert gas treatments that may be applied on a sheet, a carrier, or both, to control van der Waals, hydrogen and covalent bonding between a sheet and carrier. The modification layers bond the sheet and carrier together such that a permanent bond is prevented at high temperature processing as well as maintaining a sufficient bond to prevent delamination during high temperature processing.

公开(公告)号：US20210309565A1

公开(公告)日：2021-10-07

申请号：US17354135

申请日：2021-06-22

Applicant: Corning Incorporated ,  La Corporation de l'Ecole Polytechnique de Montreal

Inventor： Bill Baloukas ,  Robert Alan Bellman ,  Shandon Dee Hart ,  Karl William Koch, III ,  Carlo Anthony Kosik Williams ,  Ludvik Martinu ,  Charles Andrew Paulson ,  James Joseph Price ,  Jincheng Qian

IPC: C03C17/245 ,  H05K5/00 ,  H05K5/03

Abstract: An article is described herein which includes: a transparent substrate having a primary surface; and a protective film disposed on the primary surface, such that each of the substrate and the protective film have an optical transmittance of 20% or more in the visible spectrum, and such that the protective film includes at least one of: (1) a hardness of greater than 13 GPa, as measured by a Berkovich nanoindenter, or (2) an effective fracture toughness (Kc) of greater than 2.5 MPa·m1/2, as measured by indentation fracture at a depth of greater than 1 μm.

公开(公告)号：US11114309B2

公开(公告)日：2021-09-07

申请号：US16524925

申请日：2019-07-29

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Shiwen Liu

IPC: B32B3/26 ,  B32B33/00 ,  C03C15/00 ,  C03C17/22 ,  C03C17/30 ,  C03C23/00 ,  B05D3/00 ,  B05D3/06 ,  B05D3/10 ,  B05D5/00 ,  H01L21/48 ,  H01L21/308 ,  H01L21/311 ,  B05D1/00 ,  H01L21/683 ,  H01L23/498 ,  H01L21/768 ,  B23K103/00 ,  B23K26/53 ,  B32B17/06 ,  C03C3/04 ,  C23C16/27

Abstract: Methods of forming vias in substrates having at least one damage region extending from a first surface etching the at least one damage region of the substrate to form a via in the substrate, wherein the via extends through the thickness T of the substrate while the first surface of the substrate is masked. The mask is removed from the first surface of the substrate after etching and upon removal of the mask the first surface of the substrate has a surface roughness (Rq) of about less than 1.0 nm.

公开(公告)号：US20210003744A1

公开(公告)日：2021-01-07

申请号：US17018624

申请日：2020-09-11

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Shandon Dee Hart ,  Karl William Koch, III ,  Carlo Anthony Kosik Williams ,  Charles Andrew Paulson ,  James Joseph Price

IPC: G02B1/14 ,  C23C14/08 ,  G02B1/115 ,  C23C14/10 ,  G02B5/28 ,  C03C21/00 ,  C03C17/34 ,  C23C14/22 ,  B29D11/00 ,  C23C14/00

Abstract: A coated article is described herein that may comprise a substrate and an optical coating. The substrate may have a major surface comprising a first portion and a second portion. A first direction that is normal to the first portion of the major surface may not be equal to a second direction that is normal to the second portion of the major surface. The optical coating may be disposed on at least the first portion and the second portion of the major surface. The coated article may exhibit at the first portion of the substrate and at the second portion of the substrate hardness of about 8 GPa or greater at an indentation depth of about 50 nm or greater as measured on the anti-reflective surface by a Berkovich Indenter Hardness Test.

公开(公告)号：US20200039872A1

公开(公告)日：2020-02-06

申请号：US15739321

申请日：2016-06-22

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Robert George Manley ,  Prantik Mazumder

IPC: C03C15/02 ,  B32B17/10 ,  C03C17/32 ,  C03C27/10

Abstract: An article includes a carrier including a carrier bonding surface, a sheet including a sheet bonding surface, and a surface modification layer disposed on at least one of the carrier bonding surface and the sheet bonding surface. The surface modification layer includes a plasma polymerized material. The plasma polymerized material planarizes the at least one of the carrier bonding surface and the sheet bonding surface. The carrier bonding surface and the sheet bonding surface are bonded with the surface modification layer so that the carrier is temporarily bonded with the sheet. A method of making an article includes depositing a surface modification layer on at least one of a carrier bonding surface and a sheet bonding surface. The method further includes bonding the carrier bonding surface and the sheet bonding surface with the surface modification layer to temporarily bond the carrier with the sheet.

公开(公告)号：US10186673B2

公开(公告)日：2019-01-22

申请号：US15667138

申请日：2017-08-02

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Mingqian He ,  Timothy Edward Myers ,  Weijun Niu ,  David Neal Schissel ,  Kristi Lynn Simonton ,  Arthur Lawrence Wallace

IPC: H01L51/05 ,  H01L51/10 ,  H01L51/00

Abstract: Articles utilizing polymeric dielectric materials for gate dielectrics and insulator materials are provided along with methods for making the articles. The articles are useful in electronics-based devices that utilize organic thin film transistors.

公开(公告)号：US20180297324A1

公开(公告)日：2018-10-18

申请号：US15921034

申请日：2018-03-14

Applicant: Corning Incorporated

Inventor： Kaveh Adib ,  Robert Alan Bellman ,  Dana Craig Bookbinder ,  Theresa Chang ,  Shiwen Liu ,  Robert George Manley ,  Prantik Mazumder

IPC: B32B7/06 ,  B32B17/06 ,  C03C27/10 ,  C03C27/06 ,  C03C23/00 ,  C03C17/22 ,  B32B7/02 ,  B32B37/26

Abstract: A method of controllably bonding a thin sheet having a thin sheet bonding surface with a carrier having a carrier bonding surface, by depositing a carbonaceous surface modification layer onto at least one of the thin sheet bonding surface and the carrier bonding surface, incorporating polar groups with the surface modification layer, and then bonding the thin sheet bonding surface to the carrier bonding surface via the surface modification layer. The surface modification layer may include a bulk carbonaceous layer having a first polar group concentration and a surface layer having a second polar group concentration, wherein the second polar group concentration is higher than the first polar group concentration. The surface modification layer deposition and the treatment thereof may be performed by plasma polymerization techniques.