Invention Application
- Patent Title: GENERIC HIGH-DIMENSIONAL IMPORTANCE SAMPLING METHODOLOGY
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Application No.: US15696150Application Date: 2017-09-05
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Publication No.: US20180300288A1Publication Date: 2018-10-18
- Inventor: Nuo Xu , Jing Wang , Zhengping Jiang , Woosung Choi
- Applicant: Samsung Electronics Co., Ltd.
- Main IPC: G06F17/18
- IPC: G06F17/18 ; G06F17/14 ; G01R31/28

Abstract:
A method of circuit yield analysis for evaluating rare failure events includes performing initial sampling to detect failed samples respectively located at one or more failure regions in a multi-dimensional parametric space, generating a distribution of failed samples at discrete values along each dimension, identifying the failed samples, performing a transform to project the failed samples into all dimensions in a transform space, and classifying a type of failure region for each dimension in the parametric space.
Public/Granted literature
- US11003737B2 Generic high-dimensional importance sampling methodology Public/Granted day:2021-05-11
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