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1.
公开(公告)号:US20210351270A1
公开(公告)日:2021-11-11
申请号:US16900788
申请日:2020-06-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hong-Hyun Park , Zhengping Jiang , Hesameddin Ilatikhameneh , Woosung Choi , Chihak Ahn
Abstract: A method of manufacturing a p-type MOSFET includes depositing a channel material to form a channel region, forming a source region and a drain region on each side of the channel region along a first direction, depositing a gate oxide layer on the channel region along a second direction crossing the first direction, and depositing a gate electrode on the gate oxide. The channel material includes a group IV element or III-V semiconductor compound and have a diamond or zincblende cubic crystal structure. A direction of the crystal structure is parallel to the second direction. Two adjacent atoms on an out-most atomic layer of the channel region along the first direction are connected to each other via a single intervening atom, and an interface between the gate oxide layer and the channel region has a surface roughness of 1 angstrom or lower.
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公开(公告)号:US20190138897A1
公开(公告)日:2019-05-09
申请号:US15951052
申请日:2018-04-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: Nuo Xu , Zhengping Jiang , Weiyi Qi , Jing Wang , Woosung Choi
Abstract: According to one embodiment of the present invention a circuit simulator configured to simulate a degraded output of a circuit including a plurality of transistors includes: a behavioral recurrent neural network configured to receive an input waveform and to compute a circuit output waveform; a feature engine configured to model one or more degraded circuit elements in accordance with an aging time, to receive the circuit output waveform and to output a plurality of degraded features; and a physics recurrent neural network configured to receive the plurality of degraded features from the feature engine and to simulate the degraded output of the circuit.
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3.
公开(公告)号:US11171211B1
公开(公告)日:2021-11-09
申请号:US16900788
申请日:2020-06-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hong-Hyun Park , Zhengping Jiang , Hesameddin Ilatikhameneh , Woosung Choi , Chihak Ahn
Abstract: A method of manufacturing a p-type MOSFET includes depositing a channel material to form a channel region, forming a source region and a drain region on each side of the channel region along a first direction, depositing a gate oxide layer on the channel region along a second direction crossing the first direction, and depositing a gate electrode on the gate oxide. The channel material includes a group IV element or III-V semiconductor compound and have a diamond or zincblende cubic crystal structure. A direction of the crystal structure is parallel to the second direction. Two adjacent atoms on an out-most atomic layer of the channel region along the first direction are connected to each other via a single intervening atom, and an interface between the gate oxide layer and the channel region has a surface roughness of 1 angstrom or lower.
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公开(公告)号:US11003737B2
公开(公告)日:2021-05-11
申请号:US15696150
申请日:2017-09-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Nuo Xu , Jing Wang , Zhengping Jiang , Woosung Choi
IPC: G06F17/18 , G01R31/28 , G06F17/14 , G06F7/62 , G01R31/317
Abstract: A method of circuit yield analysis for evaluating rare failure events includes performing initial sampling to detect failed samples respectively located at one or more failure regions in a multi-dimensional parametric space, generating a distribution of failed samples at discrete values along each dimension, identifying the failed samples, performing a transform to project the failed samples into all dimensions in a transform space, and classifying a type of failure region for each dimension in the parametric space.
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公开(公告)号:US20180300288A1
公开(公告)日:2018-10-18
申请号:US15696150
申请日:2017-09-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Nuo Xu , Jing Wang , Zhengping Jiang , Woosung Choi
Abstract: A method of circuit yield analysis for evaluating rare failure events includes performing initial sampling to detect failed samples respectively located at one or more failure regions in a multi-dimensional parametric space, generating a distribution of failed samples at discrete values along each dimension, identifying the failed samples, performing a transform to project the failed samples into all dimensions in a transform space, and classifying a type of failure region for each dimension in the parametric space.
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