Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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Application No.: US15904634Application Date: 2018-02-26
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Publication No.: US20180308839A1Publication Date: 2018-10-25
- Inventor: Yukio TAKAHASHI
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2017-084472 20170421
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/08 ; H01L29/739 ; H01L29/861

Abstract:
A semiconductor device and a method of manufacturing the same are provided so as to suppress an increase in the forward voltage of a first diode even if a driving signal is inputted to the gate electrode of an insulating gate bipolar transistor. An IGBT has a p-type body region. An anode region of the first diode has the same impurity region as the p-type body region of the IGBT. An anode region of a second diode is surrounded by an emitter groove and thus the anode region is separated from the p-type body region of the IGBT by the emitter groove.
Information query
IPC分类: