Invention Application
- Patent Title: INTEGRATION OF VERTICAL-TRANSPORT TRANSISTORS AND HIGH-VOLTAGE TRANSISTORS
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Application No.: US15604932Application Date: 2017-05-25
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Publication No.: US20180342507A1Publication Date: 2018-11-29
- Inventor: Ruilong Xie , Chun-Chen Yeh , Kangguo Cheng , Tenko Yamashita
- Applicant: GLOBALFOUNDRIES Inc.
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/66 ; H01L29/40 ; H01L29/417 ; H01L29/51 ; H01L29/78

Abstract:
Methods and structures that include a vertical-transport field-effect transistor. A first section of a dielectric layer is deposited on a first device region of a substrate and a second section of the dielectric layer is deposited on a second device region of the substrate. A gate stack is deposited on the first device region and the second device region. The gate stack is patterned to define a first gate electrode of the vertical-transport field-effect transistor on the first section of the dielectric layer and a second gate electrode of a high-voltage field-effect transistor on the second section of the dielectric layer. The first section of the dielectric layer is a spacer layer arranged between the first gate electrode and the first device region. The second section of the dielectric layer is a portion of a gate dielectric arranged between the second gate electrode and the second device region.
Information query
IPC分类: